DFI introduces a new line of products powered by the 4th generation quad-core and dual-core Intel Core and Xeon E3-1200 v3 Series processors which are built on 22-nanometer process technology delivering up to 5~15% CPU performance increase compared with the previous generations.

DFI today launches a new Type 6 COM Express Basic module, the HM960-QM87, in its Mobile Intel QM87 chipset-based product line that provides low-power consumption and higher performance. This new COM Express Basic module with BGA 1364 packaging technology supports the 4th generation Intel Core processors built on 22-nanometer process technology and boasts a 5~15% CPU performance increase compared with its previous generations.

DFI today announces a new Type of 2 COM Express basic form factor, the CR902-B, in its mobile Intel QM77 product line. This module with BGA 1023 packaging technology supports the 3rd/2nd generation Intel Core/Celeron processor family, the next generation of 64-bit, multi-core processors built on 22/32-nanometer process technology delivering up to 15% CPU performance increase from previous generations.

DFI announce a new Type of 2 COM Express basic form factor, the CR902-B, in its mobile Intel QM77 product line. This module with BGA 1023 packaging technology supports the 3rd/2nd generation Intel Core/Celeron processor family, the next generation of 64-bit, multi-core processors built on 22/32-nanometer process technology delivering up to 15% CPU performance increase from previous generations.

Due to the increasing demand of Computer-On-Module products, aside from Type 2, DFI completed its COM Express product line by adding Type 6, Type 10, and Mini form factor. In addition, we added several COM Express products that use BGA-package processor to satisfy vertical markets that require product stability. We now offer Type 2, Type 6, and Type 10 in Mini, Compact and Basic form factors.

DFI has announced the PIC-H61, a new Full Size PICMG 1.3 board in its cost-reduced Intel H61 product line. It is powered by the 3rd/2nd Gen Intel Core processor family paired with the Intel H61 Express chipset. PIC-H61 is cross compatible with the new 3rd Gen Intel Core processors built on 22-nanometer process technology and with the 2nd Gen Intel Core processors built on 32-nanometer process technology. This cost-effective board is powerful and ...

DFI has today introduced a new desktop microATX industrial motherboard, the SB332-C, which supports 10 Serial COM ports. This microATX form factor board supports the 2nd and 3rd generation Intel CoreTM i7, i5 and i3 processors that feature 32/22-nanometer process technology with the low-cost Intel H61 chipset. These processors provide higher performance at lower power than previous processors.

DFI today releases the new Mini-ITX Industrial Motherboard – CD101-N Series, offering high efficiency with low-power consumption in its Intel Atom product line. The CD101-N Series is based on Intel Cedar Trail platform. These new dual core processors are built on Intel’s 32-nanometer process technology providing low-power consumption and yet higher clock frequencies and faster memory access than their predecessors that are built on 45-nanomet...

DFI today announces the QB702-B, a new wide temperature Qseven form factor module in its Intel Atom E6x0T product line. This new Qseven module supports the Intel Atom E620T, E640T, E660T, and E680T processors that feature 45-nanometer process technology with integrated system memory and graphics processing to provide higher performance.

DFI today launches the industrial grade EC800, DFI’s first ultra-compact palm-size fanless embedded system. Powered by the Intel Atom processor, its low power consumption design offers energy-efficient performance ideal for the embedded computing market.

DFI introduces a series of IP65 rated Panel PCs – the TPC series. Available in 3 LCD sizes (12.1”, 15”, 17”), all models support the 2nd Gen Intel Core processor family paired with the Intel H61 Express chipset. From the dual-core i3 processor to the quad-core i7 processor, the Panel PC is cross compatible with the new 3rd Gen Intel Core processors. And with the 3rd Gen processors built on 22-nanometer process technology, it makes the Pan...

DFI today launches SB102-D, a new Mini-ITX motherboard in its cost-reduced Intel H61 product line. It features the 2nd Gen Intel Core processor family paired with the Intel H61 Express chipset. From the dual-core i3 processor to the quad-core i7 processor, SB102-D is cross compatible with the new 3rd Gen Intel CoreTM processors.

DFI has today announced the launch of the most cost-effective Mini-ITX motherboard, CR101-D, in its 3rd generation Intel Core processor-based product line. It is DFI’s first Mini-ITX board supporting the new mobile Intel HM76 Express chipset. This low power board supports a range of mobile-based 3rd generation Intel Core processors built on 22-nanometer process technology and boasts a 15% CPU performance increase over the previous generation.

DFI has today announced the industrial grade EC200 T series system, the latest addition to DFI’s fanless embedded system family. Its unique modular-concept construction provides several I/O variations targeted for industrial automation applications. Virtually unlimited systems configurations are possible using low-cost OEM I/O modules designed to meet custom OEM specification requirements.

DFI brings the mobile-based 3rd generation Intel Core processor to the CR100-CRM Mini-ITX embedded board. It is DFI's first Mini-ITX board supporting the new mobile Intel QM77 Express chipset. This low power board supports a range of mobile-based 3rd generation Intel Core processors built on 22-nanometer process technology and boasts a 15% CPU performance increase over the previous generation.

DFI is pleased to announce today a new COM Express Compact module, the OT905-B series, which is one of the few in the industry that is powered by the dual-core AMD Embedded G-series APUs. It is the perfect solution for applications that require low power and significant graphics performance in a small form factor module.

DFI has today announced the release of a new series of IP65 rated Panel PCs - the KS200 series. The three 7 Panel PCs are powered by the TI AM3517 Sitara ARM Cortex-A8 microprocessor with speed up to 600 MHz. Based on the ARM architecture, the system is fanless with low power consumption.

DFI today announces the CR908-B, the first COM Express Compact module in DFI's product line based on the new Mobile Intel QM77 Express chipset. This Type 6 module supports the 3rd generation Intel Core processors in BGA 1023 package.

DFI today launches the industrial grade EC300 series system, the latest addition to DFI’s embedded system family. Its passive cooling and anti-shock drive bay mounting is designed for factory floor environments. The unique modular-concept construction supports 12 system configurations using three riser cards and three I/O module options in a cable-free assembly.

DFI today launches 2 new COM Express Basic form factor modules - CR901-B Type 6 and CR900-B Type 2, offering the 3rd generation Intel Core processors. The supported processors are built on Intel’s 22-nanometer process technology and boast a 15% greater CPU performance over the previous generation processors.