The Balver Zinn Group has announced that its U.S. division, Cobar Solder Products, will highlight the Bi Rework Solder Paste (desoldering paste) in Booth 332 at the IPC APEX EXPO, scheduled to take place 24th to 26th February 2015 at the San Diego Convention Center, California. The paste has been designed for desoldering Pb-free components and is ideal for LED removal.

Visitors to Booth #115 at SMTA International 2014 will be able to see Cobar's OT2 and WW50 solder paste, along with their latest solder wire and flux technologies. Incorporating optimised rosin based chemistry, the OT2 is a halide and halogen free solder paste delivering excellent printing and wetting properties in Pb-free. 

  Cobar Solder Products has revealed the appointment of Bill Yager as Director of Business Development. Effective immediately, Yager will manage Cobar’s representative and distributor network in the US and Mexico, and help gain approval at corporate entities.

Cobar Solder Products Inc. announces that its Cobrush flux applicator was demonstrated at the First Ever Hand Solder Competition at the recently held IPC Midwest exhibition. A precise, inexpensive and handy tool for applying liquid flux to tiny chip components as well as individual solder joints, Cobar’s Cobrush flux applicator puts flux only where it is needed — in just the right amount — and is ideal for applying liquid no-clean fluxes to...

The Balver Zinn Group announces that Gerjan Diepstraten will present a paper titled “Are Selective Soldering Fluxes Reliable,” at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX. The presentation will be held during Session MFX5 titled “Developing a Robust Soldering Process,” which will take place Wednesday, October 19, 2011 from 2-3...

The Balver Zinn Group announces that Cobar Solder Products Inc. will introduce a complete SELective soldering package in Booth #314 at the upcoming SMTA International Conference & Exhibition, scheduled to take place October 18-19, 2011 at the Fort Worth Convention Center in Fort Worth, TX.

The Balver Zinn Group announces that Cobar Solder Products Inc. will exhibit its lead-free SN100C-XF3+ solder paste and wire at the upcoming SMTA Ohio Valley Expo & Tech Forum, scheduled to take place Thursday, July 14, 2011 at the Doubletree Hotel in Cleveland, OH.