Companies

Cadence Design Systems

  • Bagshot Road Bracknell Berkshire
    RG12 OPH
    United Kingdom
  • +44.1344.360333
  • http://www.cadence.com
  • + 44.1344.869647

Cadence Design Systems Articles

Displaying 21 - 40 of 552
Industries
12th July 2023
Cadence digital, custom/analog design flows certified and design IP for Intel 16 FinFET process

Cadence Design Systems has announced its digital and custom/analog flows are certified on the Intel 16 FinFET process technology and its design IP supports this node from Intel Foundry Services (IFS).

Design
10th July 2023
Cadence and Imperas support NSITEXE RISC V

Imperas has announced that Cadence Design Systems, has collaborated with Imperas to enable NSITEXE in the development of RISC-V-based processor IP for functional safety and next-generation embedded systems. The ImperasDV RISC-V processor verification solution is fully compatible with the complete Cadence verification flow, including the Xcelium Logic Simulator and Verisium AI-Driven Platform for debug, analysis and management.

Design
28th June 2023
Cadence Virtuoso studio certified for Samsung foundry PDKs

Cadence has announced that the AI-based Virtuoso Studio design tools and solutions have been certified by Samsung Foundry.

News & Analysis
21st June 2023
DB GlobalChip deploys Cadence’s spectre FX and AMS designer

Cadence Design Systems, Inc. announced that DB GlobalChip has deployed the Cadence Spectre FX Simulator, integrated with Spectre AMS Designer, to verify its crucial analog and mixed-signal IP, achieving a 2X improvement in performance with the required accuracy compared to their incumbent flow.

News & Analysis
14th June 2023
Cadence and Samsung Foundry to expand design IP portfolio

Cadence Design Systems, Inc. has signed a multi-year agreement with Samsung Foundry to expand the availability of Cadence’s design IP portfolio on Samsung Foundry’s SF5A process technology, the latest 5nm process variant to support automotive applications.

Latest
30th May 2023
Cadence Collaborates with Arm

Cadence Design Systems announced it has continued to expand its collaboration with Arm to advance mobile device silicon success.

Wireless
27th April 2023
Cadence collaborates with GUC on AI, HPC and networking

Cadence has announced that the 112G-LR SerDes is silicon proven on the HBM3/GLink/CoWoS platform from Global Unichip Corp. (GUC).

Design
26th April 2023
Cadence and TSMC collaborate on N16 79GHz mmWave design reference flow

Cadence has announced that it has collaborated with TSMC for the Cadence Virtuoso platform for the 79GHz mmWave design reference flow on TSMC’s N16 process.

Communications
25th April 2023
Cadence tapes out 16G UCIe advanced package IP on TSMC’s N3E process technology

Cadence Design Systems has announced the tapeout of Cadence 16G UCIe 2.5D advanced package IP on TSMC’s 3nm (N3E) process technology.

Design
20th April 2023
Cadence unleashes the fFuture of analogue, custom and RFIC design

Cadence has announced the new Cadence Virtuoso Studio, a next-gen custom design platform that delivers an optimal design experience and ushers in the future for custom analogue design.

Design
18th April 2023
Cadence introduces EMX Designer delivering 10x increased performance

Cadence Design Systems announced the Cadence EMX Designer, a passive device synthesis and optimisation technology that delivers, in split seconds, design rule check (DRC)-clean parametric cells (PCells) and accurate electromagnetic (EM) models of passive devices, such as inductors, transformers and T-coils.

Memory
18th April 2023
Cadence demonstrates interoperability with SK hynix’s LPDDR5T Mobile DRAM

Cadence Design Systems has announced that it has demonstrated interoperability between the silicon-proven Cadence LPDDR5X memory interface IP and SK hynix’s LPDDR5T (Turbo) mobile DRAM, operating at speeds in excess of the LPDDR5X standard.

Artificial Intelligence
11th April 2023
Allegro X AI, accelerating PCB design

Cadence Design Systems has announced the Cadence Allegro X AI technology, a next-generation system design technology that offers revolutionary improvements in performance and automation.

Latest
9th March 2023
Cadence to invest $50 million to support racial equity

Cadence has announced that it is making a $50 million purpose-driven investment in an impact investment program managed by RBC Global Asset Management (RBC GAM) to address racial wealth inequities in affordable housing, homeownership and small business.

Design
17th February 2023
Cadence delivers 13 new VIPs and expands system portfolio

Cadence Design Systems has announced the availability of 13 new Verification IP (VIP) solutions that enable engineers to quickly and effectively verify their designs to meet the specifications for the latest standards protocols.

Artificial Intelligence
19th January 2023
GUC delivers TSMC N3 chip and AI-optimised N5 design

Using Innovus Implementation, GUC delivered a 3.16GHz HPC core design with 3.5M instances on the TSMC N3 process technology. GUC realised a 9% area shrink and an 8% reduction in power consumption on a CPU design on the TSMC N5 process using the AI-enabled Cadence Cerebrus.

Design
11th January 2023
Cadence announces 8533Mbps LPDDR5X IP solution

Cadence announced the LPDDR5X memory interface IP design optimsed to operate at 8533Mbps—up to 33% faster than the previous generation of LPDDR IP.

Design
6th January 2023
Cadence Tensilica HiFi DSP enables energy-efficient playback for Dolby Atmos

Cadence has announced that Cadence Tensilica HiFi DSP IP supports Dolby Atmos for cars making it the first DSP IP with this capability.

Latest
20th October 2022
Cadence and Samsung Foundry collab to boost 3D-IC design

Cadence Design Systems, a collaborative partner in the Samsung Advanced Foundry Ecosystem (SAFE), has announced that it has expanded its collaboration with Samsung Foundry to accelerate 3D-IC (three-dimension integrated circuit) design.

Design
12th October 2022
Cadence Certus delivers fast concurrent full-chip optimisation and signoff

Cadence Design Systems has announced the Cadence Certus Closure Solution to address growing chip-level design size and complexity challenges.

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