Boréas Technologies has introduced the BOS1901CW, a Wafer Level Chip Scale (WLCSP) version of its low-power piezoelectric driver integrated circuit (IC) for high-definition (HD) haptic feedback in mobile and wearable consumer products, including buttonless smartphones, smartwatches, game controllers and other battery-powered devices.

Boréas Technologies, developer of ultra-low-power haptic semiconductor technologies, has introduced its SmartClik technology, a proof of concept for future buttonless smartphone designs. Using Boréas’ ultra-low-power piezoelectric driver integrated circuit, the BOS1901 - which provides high definition haptic feedback for the two piezo actuators next to the frame - SmartClik replaces the smartphone’s mechanical volum...