With its newly announced NANO, an ultra-precision die and flip-chip bonder for highly demanding assembly tasks, AMICRA Microtechnologies GmbH, a worldwide leading vendor of back-end processing equipment for advanced packaging applications, is setting another record mark for die-attach accuracy. The NANO will be introduced this November at the upcoming Munich Productronica 2017.

AMICRA Microtechnologies has entered in a strategic partnership with Kanematsu PWS LTD., Yokohama, a subsidiary of Kanematsu Corporation, Tokyo. The partnership which officially started on 1 December designates Kanematsu as the exclusive distributor and contact point for sales and service matters for the entire AMICRA Microtechnologies’ product line in Japan.

Amicra Microtechnologies comes to this year's Semicon West to demonstrate its latest advanced die and flip-chip bonders AFC Plus and NOVA Plus. Amicra will exhibit at TWTC Nangang Exhibition Hall in Booth 1024.