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Advantest Europe GmbH

Advantest Europe GmbH Articles

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Analysis
13th May 2013
Advantest’s VOICE 2013 Conference Attracts Over 300 Attendees

The 2013 edition of the VOICE annual Users Group Conference organized by Advantest and a committee of partner companies, attracted over 300 test engineers and managers from 43 companies to San Jose, California, on April 23-24. This year’s event set a new record for registered attendees with many of them travelling from various locations in the United States, Canada, Europe, Israel, Asia and Japan.

Analysis
25th April 2013
Advantest Acquires System Level Test Automation Software Provider W2BI

Advantest Corporation and W2BI have reached an agreement in principle that Advantest will acquire W2BI, a provider of system level test automation software focusing on wireless communications. Based in New Jersey, W2BI will become a fully-owned subsidiary of Advantest’s US subsidiary, Advantest America. The acquisition is scheduled for finalization in May 2013, pending the completion of all required procedures.

Analysis
15th April 2013
Advantest Earns Supplier Excellence Award From Texas Instruments

Advantest has earned the Texas Instruments 2012 Supplier Excellence Award. Advantest provides the M4841 pick-and-place test handler, which TI uses with its installed automated test equipment. This is the first time that Advantest has received this supplier award from TI. Advantest has installed M4841 Dynamic Test Handlers at TI’s manufacturing facilities around the world. The versatile handler’s universal compatibility enables it to enhance t...

Analysis
3rd April 2013
Advantest Enters MEMS Testing Market with Multiple System Installations at Freescale Semiconductor’s Facilities in Arizona and Asia

Advantest has entered the high-growth market for testing micro-electromechanical system (MEMS)-based sensors by installing V93000 Smart Scale systems at several of Freescale Semiconductor’s facilities around the world.

Analysis
14th February 2013
Advantest VOICE 2013 Conference to Feature High Quality Presentations for SOC Platforms and Handlers

VOICE 2013, a user group meeting and partners conference organized by Advantest Corporation will include a robust technical program with papers from users of the T2000, V93000 and handlers. The event, to be held April 23-25 in San Jose, California, is an international forum for sharing technical content and exchanging perspectives on the latest semiconductor testing techniques and best practices.

Test & Measurement
8th January 2013
Advantest’s New Test Cell Selected by Marvell Semiconductor to Reduce Cost of Test for High-volume, Cost-sensitive ICs

Advantest Corporation today announced that the company has installed the first evaluation unit of its new test cell at Marvell, integrating the company’s T2000 Enhanced Performance Package (EPP) and its M4841 Dynamic Test Handler.

Analysis
5th December 2012
VOICE 2013 User’s Conference for SoC & Memory Semiconductor Devices & Handler Test Technologies

VOICE 2013 is an international conference focusing on innovative test solutions for system-on-chip and memory semiconductor devices and handler solutions. The 2013 conference will include technical presentations, new product kiosks, interactive discussion sessions for users of the T2000, V93000 and memory test platforms and test cell solutions, offering extensive networking and learning opportunities for all attendees. A new addition to the progr...

Test & Measurement
27th November 2012
Advantest's T2000 8-Gbps Digital Module for High-Speed Testing of SoCs

Advantest has introduced its new T2000 8GDM to address the test requirements of system-on-chip devices with high-speed serial, parallel and memory interfaces such as PCI-Express and double data rate connections. The new module will be featured in Advantest’s exhibit (booth #8C-901 in Hall 8) at the SEMICON Japan trade show, December 5-7 in Makuhari Messe in the Chiba prefecture.

Test & Measurement
26th November 2012
Advantest Introduces New Wafer MVM-SEM Tool E3310

Advantest Corporation has introduced its new Multi-Vision Metrology Scanning Electron Microscope, the Wafer MVM-SEM E3310, which measures fine-pitch patterns on a wide range of wafer types with unparalleled accuracy, utilizing Advantest’s proprietary electron beam scanning technology.

Pending
14th November 2012
Advantest Develops EB Lithography System for 1Xnm Node

Advantest has announced that it has developed a new EB (electron beam) lithography system, the F7000, with superior resolution performance meeting the requirements for 1Xnm technology nodes. The F7000 supports substrates of diverse materials, sizes, and shapes, including nanoimprint templates as well as wafers, and is optimized for diverse applications such as advanced LSIs, photonics, MEMS, and other nano-processes.

Test & Measurement
8th November 2012
Advantest Introduces T2000 IMS for Low-Cost Testing of Integrated Microcontroller and Smart Card ICs

Advantest has introduced its new T2000 Integrated Massive Parallel test solution (IMS), a massive parallel test system capable of achieving the lowest cost of test for microcontroller units with integrated analog and embedded flash memory circuits.

Automotice Microsite
1st August 2012
Advantest remporte le Prix du Meilleur Fournisseur remis par STATS ChipPAC

Premier fournisseur de bancs de test pour semiconducteurs, Advantest Corporation s'est vue décerner le Prix du Meilleur Fournisseur par la société STATS ChipPAC Ltd. (SGX-ST : STATSChP), l'un des premiers prestataires en solutions d'emballage, d'assemblage, de tests et de distribution de semiconducteurs. C’est la cinquième année consécutive qu’Advantest est distinguée par cette reconnaissance.

Test & Measurement
27th July 2012
500th V93000 Port Scale RF Tester shipped by Advantest

Advantest has announced today that it has installed its 500th V93000 Port Scale RF test system, with the landmark unit going into the engineering development laboratory of Spreadtrum Communications. Spreadtrum has begun using the versatile tester, which is equipped with both a Pin Scale 1600 digital card and a MB-AV8+ analog card, to develop semiconductor products for mobile phone applications, including RF-based system-on-chip and 3G baseband de...

Analysis
27th July 2012
STATS ChipPAC names Advantest as Best Supplier

Advantest has today announced that it has received a Best Supplier Award from Singapore-based STATS ChipPAC. This is the fifth consecutive year that Advantest has earned this supplier accolade. STATS ChipPAC’s Best Supplier Award recognizes materials and equipment suppliers for overall best-in-class performance in cost, quality, delivery, technology, service and support.

Analysis
6th July 2012
Advantest and JEM Receive Best Overall Presentation Award at IEEE SWTW 2012

Advantest Corporation declared today that the company received the Best Overall Presentation Award at the 22nd Annual IEEE Semiconductor Wafer Test Workshop for a joint presentation with leading probe card manufacturer JEM. SWTW 2012 was held June 10 - 13, 2012, in San Diego, CA, USA.

Test & Measurement
6th July 2012
Advantest Introduces Industry’s Highest Capability 3-in-1 Semiconductor Test Clock Module to Improve Yields and Save Time & Money in Testing High-Speed ICs

Advantest Corporation have introduced the new T2000 LJC16 16-channel, low-jitter-clock module. The LJC16 module, which combines different digital clock and analog clock/sine-wave requirements in a single high-multi-site system, will be featured in Advantest’s booth (#6247 in North Hall) at the SEMICON West trade show, July 10-12 in San Francisco.

Analysis
4th July 2012
Advantest Breaks Ground for Cheonan, S. Korea Factory

Advantest today announced that its South Korean subsidiary, Advantest Korea broke ground on June 28 for its new factory in Cheonan City, Chungnam Province, South Korea.

Test & Measurement
20th June 2012
Hua Hong NEC Advantest Co-Develop Wafer-Level High Parallelism Multi-Site Test Solution RFID Devices

Shanghai Hua Hong NEC Electronics Company, Ltd. and Advantest Corporation have collaborated to successfully develop a wafer-level, multi-site parallel test solution for radio-frequency identification semiconductor devices that meet industry-standard ISO 14443 guidelines.

Test & Measurement
6th June 2012
Advantest Announces 3D TSV Stack Test Solutions

Advantest Corporation today announced that a new product line of fully automated and integrated test and handling solutions for TSV based 2.5D and 3D products is under development. The concept model test cell dubbed, DIMENSION, integrates a high parallel test cluster along with singulated die and 3D die stack automated handling capabilities.

Test & Measurement
6th June 2012
Advantest Announces Memory Test System T5811

Advantest Corporation today announced its new memory test system, the T5811, targeting DRAM memory core test. Available from July 2012, the T5811 reduces power consumption by 90% and floor-space requirements by two-thirds, compared to previous models, and is upgradable via a simple exchange of components.

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