An industrial-grade ATX motherboard powered by a 4th generation Intel Core i processor has been introduced by Advantech. SIMB-A31, which also features the company’s SUSIAccess 2.0 Pro version, is suitable for a wide range of industrial applications such as automation, ATMs and kiosks.

Advantech is pleased to announce its support of the newly released Windows 10 IoT. Windows 10 IoT will power a range of intelligent connected devices from smaller equipment such as gateways or mobile POS units, to industrial devices like robots and specialty medical equipment. Designed to connect through Azure IoT Services, Windows 10 IoT offers enterprise-grade security along with native connectivity for M2M and machine-to-cloud scenarios.

An IoT gateway solution powered by the Intel Quark SoC x1000 processor and designed as a compact size, high capability, multi-connectivity gateway has been released by Advantech. The UBC-221 is suitable for IoT or automation control applications such as smart city parking, security and surveillance as well as industrial control. 

An ARM-based compact box computer powered by a Freescale ARM Cortex-A9 i.MX6 Dual Lite high-performance processor, the UBC-220, has been announced by Advantech. Designed with compact size, high capability and superior connectivity, UBC-220 is an indoor computing gateway suitable for smart buildings, parking lots and public spaces.

A comprehensive IoT Gateway Development Kit bundle with Intel Gateway Solutions for IoT, has been announced by Advantech. This solution features a pre-integrated software and hardware platform containing a Linux OS, security and management features. This out-of-the-box solution simplifies customer deployment of IoT products and allows secure data aggregation, filtering and analysis from edge devices to the cloud through WiFi and/or even 4G techno...

  Advantech has announced the release of its low power, fanless COM Express Mini Module, the SOM-7568. It is equipped with the latest Intel Pentium N3700, Celeron N3150 and Celeron N3000 single-chip processors, which are manufactured on new Intel 14nm process technology.

A THIN Mini-ITX enclosure, which supports the latest Intel and AMD platforms for enhanced energy efficiency and graphics performance, has been introduced by Advantech. Featuring a single system fan design with smart fan control, the AIMB-T1000 supports up to 25W TDP SOC in a variety of configurations.

Advantech has announced the certification of the RISC-based digital signage player, UBC-DS31, for the Media4Display digital signage software. Media4Display is an intuitive digital signage software to remotely broadcast multimedia data in real-time to a network of displays located at various points of sale, offices and public places.

A COM Express R2.1 Compact Module in Type 6 pin-out module board, which is powered by the latest 5th gen Intel Core processor, has been introduced by Advantech. Low power consumption and high CPU and graphics performance are provided by the processor. The SOM-6896 is built for use in demanding applications such as medical equipment, automation and gaming.

Advantech presents two of its latest products powered by the TI Sitara AM3352 Cortex-A8 1GHz high performance processor, the RSB-4220 3.5” SBC and the UBC-FA30 computing box. The low power Sitara AM3352 design uses only 2.8W and comes with rich I/O features such as UART, Giga LAN, CANbus and more. They are suited for applications in industrial automation and IoT devices.

Advantech has announced the release of its latest COM Express (PICMG COM.0) R2.1 Basic Module in a Type 6 pin-out module board. The SOM-5893 is equipped with the latest 2nd gen AMD embedded R-series APU, and offers eye-catching graphics performance.

Advantech has announced the arrival of the MIO-2263 SBC in a 2.5” Pico-ITX (100x72mm) form factor. Based on the Intel Atom processor E3800 product family, it is the first SoC designed for intelligent systems with quad core computing, high graphics and media performance. MIO-2263 is a fanless SBC designed for operation across the temperature range of -40 to +85°C.

An SBC and a computing box, powered by the TI Sitara AM3352 Cortex-A8 1GHz processor, have been released by Advantech. Equipped with 512MB of DDR3 memory and 4GB flash ROM onboard, the RSB-4220 SBC and the UBC-FA30 computing box are suited the industrial and IoT markets. 

Advantech-Innocore has declared the ICE 2015 tradeshow a ‘huge success’, highlighting elevated interest in its products, especially the DPX-S435, DPX-S1435, DPX-E130 and display products range. Advantech Display Solutions (ADS) is a product division formed when GPEG International joined Advantech last year. ADS offers gaming industry customers specialised monitor and display solutions.

Advantech has released an updated product roadmap outlining its product coverage expansion plans for 2015. To cope with Big Data computing demands from the rapidly growing IoT market, Advantech is extending its current SQFlash portfolio of CF, DOM, CFast, mSATA, half-slim, and 2.5” SSD modules to include an updated line of server storage products - the T1 Series.

A series of node and gateway devices, which allows System Integrators to build their own IoT environment, has been released by Advantech. The WISE-3000 devices, which feature WISE-cloud IoT software, provide remote device management, reliable data acquisition and security protection for many IoT applications.

The use of Flash memory is ubiquitous, but the introduction of multi-level cell technology could make it even more prolific. By Ethan Chen & Precyan Lee, Advantech.

  RISC processors, rugged platforms and standardised software solutions are helping manufacturers meet the opportunity of a more connected world. By Aaron Su, Director Embedded Core Group, Advantech.

Designed for RISC-based COM hardware platforms powered by the Freescale ARM Cortex-A9 i.MX6 processor, EVKs have been released by Advantech. The EVKs, which can be used with Qseven, SMARC and RTX 2.0 processors, evaluate function and performance validation, hardware design and application development.

Advantest has a new mold thickness metrology system, the TS9000, for measuring the thickness of semiconductor packaging. The system is based on advances in Terahertz (THz) technology pioneered by Advantest. The TS9000 Mold Thickness Analysis (MTA) System is a new metrology tool that performs non-destructive analysis of the thickness of semiconductor packaging.