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Adeia

Adeia Articles

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Awards
15th July 2024
Adeia wins ECTC Award for “Fine Pitch Die-to-Wafer Hybrid Bonding” paper

Adeia was awarded Best Session Paper at the 2024 Electronic Components and Technology Conference (ECTC) held in Denver, Colorado on May 28-31, 2024. Find more industry awards, here.

Events News
6th February 2024
Adeia hybrid bonding at Chiplet Summit 2024

Adeia have announced that it is showcasing its hybrid bonding technology at the Chiplet Summit on 6th to 8th February 2024, at the Santa Clara Convention Centre. 

Analysis
19th January 2024
Adeia finds increase in demand for AI chipsets

Adeia research has found an increased demand for AI chipsets which will spur requirements for hybrid bonding technology across the semiconductor industry.

News & Analysis
31st March 2023
Adeia signs long-term semiconductor patent license agreement

Adeia, the company whose patented innovations enhance billions of devices, has announced that Kioxia Corporation, a global specialist in flash memory and solid-state drives, entered into a long-term agreement to license Adeia’s semiconductor patent portfolio, including those relating to hybrid bonding.

News & Analysis
29th March 2023
Adeia signs long-term semiconductor patent license agreement

Adeia, the company whose patented innovations enhance billions of devices, has announced that Western Digital, a global specialist in data storage solutions, entered into a long-term agreement to license Adeia’s semiconductor patent portfolio, including those relating to hybrid bonding.

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