10 ECP ap tools purchased by top-tier Chinese OSAT to support wafer-level packaging applications

The new product uses a wet etch method to remove various types of dielectric, metal and organic material films, as well as particulate contaminants on the wafer edge. This approach minimises the impact of edge contamination for subsequent process steps, and improves chip manufacturing yield.

ACM Research have announced the launch of their Ultra ECP GIII plating tool to support WLP for compound semiconductors, with product offerings for silicon carbide (SiC), gallium nitride (GaN) and gallium arsenide (GaAs). The tool is also capable of plating gold (Au) into backside deep hole processes with greater uniformity and better step coverage. The tool features a fully-automated platform to support high volume manufacturing that ac...