Wi-Fi 6/6E modules target IIoT connectivity

Designed specifically for next-generation industrial IoT connectivity applications, these robust, rugged and compact modules provide easy integration and highly reliable connectivity, allowing access to both PCIE and SDIO interfaces in a pluggable card or SMT M.2 packaging.

These Laird Connectivity modules are high-performance, industrial-grade devices that are powered by Infineon Technologies' leading AIROC CYW55573 chipset, enabling Wi-Fi 6/6E beyond its standard requirements and enhancing the module's range, reliability and robustness in congested networks for IoT applications or lower latency in AI applications. The modules support a tri-band 2x2 MIMO IEEE 802.11a/b/g/n/ac/ax WLAN with data rates up to MCS11 (287 Mbps PHY data rate for 2.4 GHz; 1.2 Gbps PHY data rate for 5/6 GHz) and dual-mode Bluetooth. The module's full digital MAC and baseband engines handle all 802.11 CCK/OFDM/OFDMA 2.4/5/6 GHz and Bluetooth 5.4 (basic rate, enhanced data rate, and Bluetooth low energy) baseband and protocol processing capabilities.

Adaptable to a variety of harsh RF IoT applications, the Sona IF73 modules feature an integrated power amplifier (PA) and low noise amplifier (LNA), plus 2x2 MU-MIMO antennas for reliable connectivity.

Along with its low-power consumption and radio architecture, the modules also feature a power management unit (PMU) with proprietary power-save technologies that help extend battery life. Additional features include support for WPA3 security standards and open-source software (Linux Backports package).

The Sona IF73 modules are available in M.2 2230 E-Key and M.2 1318 solder-down form factors and carry FCC, IC, CE, RCM, MIC and Bluetooth SIG approvals worldwide. The modules are specified at an industrial temperature range of -40ºC to +85ºC, and their target applications include industrial IoT sensors and gateways, rugged handheld devices and medical equipment.

The modules are available from Mouser in the EMEA, Americas and Asia/Pacific regions.