Communications

Toshiba and Panasonic cooperate on highly integrated Bluetooth module

21st August 2012
ES Admin
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Toshiba Electronics Europe and Panasonic Industrial Devices Sales Europe have announced that they are cooperating on a highly integrated module that will enable users to add Bluetooth connectivity to devices easily and efficiently. Target applications will include industrial, automation, medical, personal sport and fitness equipment.
The module will combine Toshiba’s single chip TC35661 Bluetooth semiconductor device and software stack with Panasonic’s design and manufacturing expertise in module production. The TC35661 is a highly integrated and compact Bluetooth controller that delivers high-speed operation at ultra-low power. It significantly reduces external component count and power consumption in applications requiring Bluetooth Classic and Bluetooth Low Energy functionality. This provides the low-power and rapid connection and disconnection functions, needed by a wide range of applications using smaller form factor devices. It will round off Panasonic’s module portfolio by offering an easy to integrate module with various embedded, Bluetooth qualified profiles.

Armin Derpmanns, General Manager Business Development, Toshiba Electronics Europe, commented: “This cooperation will give customers access to a highly effective Bluetooth solution that significantly reduces the design and integration effort required for incorporating the latest Bluetooth technology into their products. It also provides the high performance and low energy consumption that will be essential for many next-generation portable devices.”

Matthias Frey, Product Marketing Director, Panasonic Industrial Devices Sales Europe, added: “The combination of Panasonic’s experience in high quality module production and Toshiba’s track record in leading edge silicon and software development means that together we can deliver a compelling Bluetooth solution for product developers in many markets. This is supported by the peace of mind that results from working with two of the leading companies in their respective sectors.”

Designed and manufactured in Europe, the module will be marketed worldwide with an initial focus on Europe and USA. The first product is planned for release in Q4 2012.

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