STB chipsets enable large-scale migration to HEVC

ST's STB devices benefit from a scalable hardware and software architecture enabling flexible platform configurations to reach optimised price/user experience ratio across the different HD HEVC entry STB segments. All chipsets in the ARM-based family are pin-to-pin compatible to facilitate design re-use among the different broadcast technologies. Software compatibility with ST's Cannes SoC family enables OEMs to benefit from the comprehensive ecosystem in order to easily design innovative client boxes on multiple middleware products.

Addressing the satellite markets, the STiH337/STiH332 SoCs implement a DVB-S2X demodulation scheme enabling MSOs (Multiple System Operators) to leverage compression-efficiency improvements brought by the HEVC technology. This results in the enhancement of S2X spectral efficiency for optimal use of the satellite transponder capacity.

"Our ARM-based chipset family strengthens ST's presence in all the segments of the very dynamic HD HEVC entry STB broadcast markets. It also underlines our strong engagement and capacity to deliver innovative solutions," said Philippe Notton, Group Vice President and General Manager, Consumer Product Division, STMicroelectronics. "With the Liege3 SoC family, MSOs can maximise the lifetime of their HEVC investments with a chipset platform that integrates enough processing power for future evolution while today supporting all the latest key interfaces and broadcast technologies for optimal spectrum usage."