SESUB technology cuts Bluetooth module by 60 per cent

25th January 2016

Mick Elliott

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Datasheet

The SESUB-PAN-D14580 Bluetooth v4.1 module from TDK is now being shipped by Mouser Electronics. The ultra-compact, Bluetooth 4.1 Low Energy (LE) micro module is the world’s smallest module for Bluetooth Smart devices. The 3.5mm × 3.5mm × 1mm SESUB-PAN-D14580 module is based on TDK’s proprietary Semiconductor Embedded in Substrate (SESUB) technology, reducing the size by 60 percent compared to modules using discrete components.

The single-mode module’s ultra-compact footprint and low current consumption make it ideal for battery-powered wearable devices where small size, light weight, and low power consumption are essential

The module integrates a Dialog Semiconductor DA14580 Bluetooth 4.1 chip, 32-bit ARM Cortex-M0 microcontroller, and DC-DC converter onto a thin substrate, along with all peripheral circuitry including a 16MHz crystal, induc-tor, and capacitor.

All inputs and outputs (I/O) from the substrate layers are routed to a ball grid array (BGA) footprint on the module’s bottom surface. Interfaces include UART, SPI, and I²C, helping to speed the hardware design process and allowing fast and easy implementation of Bluetooth connectivity.

The low-power module requires a voltage supply of 3.0V, and consumes only 5.0mA when transmit-ting, 5.4mA when receiving, and 0.8µA in standby mode. Output power is rated at 0 dBm (typ.), with a communication range of 10 meters, depending on line of sight and antenna characteristics.