Faster development achieved with Bluetooth starter kit

The kit is based around a Panasonic PAN1026 module featuring an embedded “Chiron-501” IC with a dual mode Bluetooth protocol stack and profiles. Also included is a Toshiba TMPM369 ARM Cortex-M3 based MCU with 512KB flash memory. The embedded dual mode software has a SPP and Bluetooth Low Energy GATT API for device set up, connection and data transfer. The function set of the Bluetooth IC is accessed by a high level driver layer. Application examples, available on the internet, can be compiled to run on the TMPM369 MCU with FreeRTOS integration (OS itself is available from Real Time Engineers Ltd). The application software includes a set of BLE standard reference profiles and a design guide on how to develop a proprietary BLE profiles.

Compatible with third party toolchains, such as Atollic and IAR, a J-Link JTAG debugger interface is incorporated in the starter kit board. The embedded MCU also supports standard interfaces on the board for Ethernet, CAN, USB (host and device), serial and UART connection.

The kit is compliant with the Bluetooth v4.0 communication standard, with Toshiba’s Chiron IC able to support both Bluetooth Classic and Low Energy communication methods. The Bluetooth Classic communication method enables serial communication with a wide range of devices such as smartphones, laptops and other (legacy) Bluetooth peripherals, while the low energy “Bluetooth Smart” method reduces power consumption and shortens connection set up time. It is designed for portable peripheral devices such as temperature meters, remote switches and controls or various sensors. The two standard Bluetooth communication methods are not interoperable and require different device applications to match the communication method of the host appliance.

By incorporating both the SPP that is used for Basic Classic communication and the GATT used for Low Energy communication into a single IC, Chiron contributes to component reduction and development efficiency efforts. The SPP and GATT profiles on-chip also reduces loads on external MCUs and simplifies Bluetooth certification process significantly.