Ethernet bridge IC for automotive and industrial applications

Real time processing and reliable data transmission is critical to support telematics, infotainment, driver assistance systems and various sensor data to enable a fully connected vehicle.

New standards, including Ethernet AVB and TSN, are becoming adopted in automotive and industrial applications to meet the increased performance requirements.

Toshiba’s TC9562 series is designed for reliability and performance delivering Ethernet bridging capability up to 1Gbps transfer rate. The new automotive bridge IC also supports Time Sensitive Networking (TSN) protocol for various industrial and commercial applications.

The TC9562 series’s advanced capabilities supports Ethernet AVB specification, specifically IEEE 802.1AS and IEEE 802.1Qav, as well as TSN standards IEEE 802.1Qbv, IEEE 802.1Qbu and IEEE 802.3br. The New IC also supports a broad range of interfaces including PCI Express 2.0 and 1.0, I2S/TDM, RGMII, RMII, MII and an option for SGMII for expanded interfaces to various IVI SoC solutions.

“We had the pleasure of working with Toshiba to feature their Ethernet bridge IC solutions in our industry-leading Qualcomm Snapdragon 820A Platform,” said Shyam Krishnamurthy, Senior Director of Qualcomm Technologies. 

“We look forward to continuing our combined efforts to design cutting-edge solutions to support highly advanced automotive cockpit and telematics applications.”

Armin Derpmanns, General Manager, Semiconductor Marketing, Toshiba Electronics, commented: “We are pleased to expand the successful automotive Ethernet bridge IC series to the market. We hope to help accelerate the Ethernet adoption in automotive applications.”

The TC9562 series will be automotive qualified and packaged in P-LFBGA120 in 9x9mm package.