Communications
EC200 Series System Features Modular Construction Targeting Industrial Computing Applications
DFI today launches the industrial grade EC200 series systemwith passive cooling and anti-shock drive bay mounting designedfor factory floor environments. The unique modular-concept construction supports 12 system confi gurations using three riser cards and three I/O module options in a cable-free assembly. Virtually unlimited systems confi gurations are possible using low-cost OEM I/O modules designed to meet custom OEM specifi cation requirements.
All The ability to withstand harsh environments is crucial to maintain system reliability in factory floor and other automation computing applications. said Morris Liu, Vice President of Sales – DFI® Inc. The EC200 series system utilizes passive cooling, anti-shock hard drive mounts, and ruggedized cable-free board assembly to protect against system failure. The unique modular-concept construction of the EC200 product line enables DFI® to offer 12 different off-the-shelf models, insuring a wide-range of quick-turn system assemblies for our distributors, integrators and OEM customers.
This low-power industrial system is ideal for applications requiring a stable revision-controlled platform with flexible system confi guration, such as industrial control, factory floor automation, pharmaceutical management & dispensing, and POS systems.
Features:
1.8GHz dual core Intel® Atom™ processor D525
Fanless, passive heatsink cooling
Single 19-24V DC power input, with AC adapter
Desktop, VESA, and Wall mounting
2.5” SATA HDD bay, CompactFlash socket
Up to 4GB DDR3 800MHz memory
1 Mini PCIe expansion card slot
2 Wi-Fi module antenna mounting holes
2-channel Analog and HD Audio support
Shock: Operating, TBD
Vibration: Operating, 1G peak, 10-300Hz, 3 axis with HDD; Operating, 6G peak, 10-300Hz, 3 axis
with CF/SSD
Temperature: Operating 0° to 50°C, Storage -20° to 70°C
Certifications: UL, CE and FCC Class B approvals