DSM expands its automotive electronics portfolio

Automotive electronics contribute to 90% of all innovations in cars. While auto makers are incorporating ever more electrical content, we’re seeing increased engine temperatures and vibration profiles, part miniaturisation, Internet-connected cars, autonomous driving, and a shift toward hybrid and electric drivetrains.

Such changes are placing strenuous new demands on materials, but DSM is keeping pace by investing in its portfolio in engineering plastics.

• Consider the following:
  The development of smaller, lighter-weight vehicle engines that produce the same or greater amount of power tends to create higher ambient operating temperatures and vibration profiles, and generally harsher conditions;
• The trend toward miniaturising components, including connectors, electronic control units (ECUs), and the like, requires thinner part walls and higher-flowing materials;
• Automotive OEMs and their suppliers have increasing environmental concerns that are leading to greater adoption of halogen-free materials.

“Increasing electrical and electronic content in cars means connectors are expected to transmit increasing amounts of signal and power in the same or even less space. The higher density of pins, as well as pitch reduction, is driving the need for thinner walls and higher flow”, explains Ralph Ramaekers, Global Marketing Manager Automotive at DSM.

“All these trends require a broad materials portfolio that takes into account a vast range of key criteria. DSM is one of the few suppliers in the world that can offer a full-service portfolio of thermoplastic resins for automotive electronics applications.

Its materials include PBT, PA6, PA66, PET, PPS, PA410, PA46 and PA4T, and span the entire product performance/price spectrum – and yet we continue to invest to ensure we can offer solutions to meet any market need”, Ramaekers continues.

Extension of portfolio with Akulon PA66 Ultraflow

DSM launches three grades of its Akulon PA66 Ultraflow resin, with outstanding flow and mechanical strength performance and superior elongation at break.

Akulon PA66 Ultraflow offers excellent flow and processing with a key combination of mechanical properties for increasing performance, higher terminal retention, and robust latch performance.

It meets the requirements for increasingly high-density connectors with smaller footprint, offers better flow, and can reduce tool wear and maintenance with lower cavity pressures. High cavitation capabilities in tooling can further reduce cycle times, production costs and the energy needed to manufacture.

DSM sees the new material as being ideal for thin-walled connectors, sensors, and control devices, and as a replacement for syndiotactic polystyrene (SPS), polybutadiene terephthalate (PBT), and other grades of PA66.

In addition to its long-established offerings for electronics, DSM has added new PPS and PA66 product lines, while also introducing several new product areas applicable to the segment, including: thermally conductive compounds; electro-friendly (halogen-free) materials; high-temperature, low-blistering resins; and high-flow materials for thin-walled electronics.

The addition of PPS provides new solutions for such applications as hybrid/high-voltage e-motors, ECUs and battery pack components. These resins offer great dimensional stability, as well as high impact strength to combat long-term heat aging.

Later this year DSM plans to launch additional, new offerings – such as a PA4T full JEDEC1 HB grade, an expanded PBT portfolio, and several solutions for vehicle connectivity, including LDS (Laser Direct Structuring).

“Within each product line, it has specialised grades that cater to the specific trends and requirements for the dynamic automotive electronics industry. Whether for connectors, control devices, sensors, lighting, e-motors, or any other conceivable application in that sector, think of DSM as your one-stop-shop materials partner in engineering plastics”, encourages Mark Terlaak, Global Industry Manager Automotive E&E at DSM.