Communications
DFI Announces COM Express Module HR900-B Supporting 2nd Generation Intel Core i7-2710QE Processor
DFI today launches the COM Express basic type 2 form factor HR900-B mobile platform offering higher processing performance, superior graphics display support, and evolutionary memory system and I/O interface improvements. This embedded module uses an Intel® QM67 Express chipset supporting the quad core 2nd Generation Intel® Core™ i7-2710QE processor and dual core 2nd Generation Intel® Core™ i5-2510E processor on 32nm process technology.
provide Intel® HD graphics support for DVI-I, LVDS and VGA display interfaces. The
32nm Intel® Core™ microarchitecture provides higher performance at lower power
than previous generation processors, and includes the first mobile quad-core
processor with an integrated graphics core. Performance is further increased through
the introduction of Intel® Advanced Vector Extensions (Intel® AVX) to the instruction
set, providing acceleration of complex audio, video, and image processing.
In addition, this new platform supports Intel® Hyper-Threading and improved Intel®
Turbo Boost Technology 2.0, which enables each processor core to handle two
instruction threads and dynamically increase the clock speed when all cores are not
fully utilized. This provides increased performance over the previous generation
platform for both multi-core and non-multi-core optimized application programs. The
combination of Intel Hyper-Threading, Intel Turbo Boost Technology improvements,
and the new three-level cache subsystem insures higher performance at reduced
power consumption across a broad-spectrum of embedded processing applications.
Support is provided for up to 8GB of DDR3 1066/1333 MHz dual-channel system
memory, two Gigabit LAN controllers, and up to four display ports using carrier based
DVI, HDMI, LVDS, and VGA display interfaces. The integrated Intel® HD graphics
engine supports six graphics execution units with dynamic turbo boost to accelerate
video processing, and Intel® Clear Video Technology providing advanced imaging
capability for Blu Ray° and other high definition video processing.
The HR900-B also supports Intel® High Definition Audio, two Serial ATA ports with
speed up to 3Gb/s, two Serial ATA ports with speed up to 6Gb/s, eight USB 2.0 host
controller ports, one PCI Express x16 expansion interfaces (Gen 2), 5 PCI Express x1
expansion interfaces, and 4 PCI expansion interfaces.
This embedded COM Express basic type 2 form factor module is ideal for applications
requiring a stable revision-controlled platform such as industrial control automation,
digital signage, kiosk, medical equipment, and gaming embedded applications.
HR900-B Features:
PICMG COM Express R1.0 basic form factor, type 2 (95mm x 125mm)
Supports 2nd Generation Intel® Core™ i7-2710QE and i5-2510E
processors
Intel® BD82QM67 Platform Controller Hub
Up to 8GB of DDR3 1066/1333 MHz dual-channel memory
SDVO and VGA display interfaces
18/24bit LVDS display interface
2 Gigabit Ethernet LAN ports
2 SATA ports (3Gb/s)
2 SATA ports (6Gb/s)
8 USB ports
1 PCI Express x16 expansion interface (Gen 2)
5 PCI Express x1 expansion interfaces
LPC Interface
8 Digital I/O Interfaces
Operating Temperature Range 0°C to 60°C