Communications
Package Innovation from STMicroelectronics Shrinks Antenna Couplers to Improve Connection Reliability and Battery Life
STMicroelectronics has unveiled two new chips for controlling antenna power in mainstream 3G wireless products. The new devices are more than 83% smaller than earlier components and improve energy efficiency to maximize battery life for always-on-the-go consumers and business users.
TodaThe CPL-WB-00D3 and DCPL-WB-00D3 are single- and dual-path antenna couplers intended for single- and dual-antenna systems. By also integrating attenuators on coupled and isolated ports, the antenna couplers simplify circuit design while saving cost and pc-board space. This extra integration is achieved using ST’s proprietary Integrated Passive Device (IPD) technology; other types of couplers need separate attenuators. In addition, insulated glass-substrate fabrication and wafer-level packaging reduce total device height and footprint compared to alternative Low-Temperature Co-fired Ceramic (LTCC) technology.
The new devices are the latest evolution of ST’s miniature bidirectional couplers with IPD inductors, and have dimensions as small as 1.3 x 1.0mm compared with earlier 1.7 x 1.4mm devices. The smaller packaging frees extra pc-board space inside 3G devices. With low insertion losses, high directivity and a wide operating frequency range, the antenna couplers are compatible with all 3G network standards, from GSM/EDGE to WCDMA/TD-SCDMA.
Major features of CPL-WB-00D3 and DCPL-WB-00D3:
• 50-ohm nominal input / output impedance
• Operating frequency range: 824MHz to 2170MHz
• Less than 0.2dB insertion loss
• 34dB typical coupling factor
• 25dB typical directivity
• Dimensions:
• 1300 x 1000µm x 690µm (CPL-WB-00D3)
• 1670 x 1440μm x 650µm (DCPL-WB-00D3)
The CPL-WB-00D3 and DCPL-WB-00D3 are in volume production now, priced at $0.215 and $0.305 for 1000 units, respectively. Alternative pricing options may be available for higher quantities.