ADLINK Technology - Atom-based Compact COM Express Modules

26th November 2009

ES Admin

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ADLINK Technology presents the Express-ATC and Ampro by ADLINK Express-ATR, two low-power, long-lifecycle computer-on-modules (COMs) based on the cost-effective, ultra low power Intel® Atom™ processor N270 and Mobile Intel® 945GSE Express Chipset and supporting up to 2 GB of DDR2 533MHz memory on a single SODIMM socket. The Express-ATC and Express-ATR are Compact COM Express™ modules measuring only 95 x 95 millimeters, and are fully compatible with the Type 2 pin-out of the PICMG® COM Express specification.

While the Express-ATC and Express-ATR are based on the same CPU and chipset, these modules are designed for two distinct industry markets. The Express-ATC is targeted for entry-level embedded and mobile applications requiring full graphics features in a compact package. The Express-ATR is specially designed from the top down using the Ampro by ADLINK™ Extreme Rugged™ design methodology for applications that require MIL-STD-202F shock and vibration compliance and extended -40 to +80°C operating temperature range, such as rugged portable military devices.

The Mobile Intel® 945GSE Express Chipset provides both the Express-ATC and Express-ATR with support for high resolution CRT, single/dual channel LVDS and TV out (SDTV and HDTV). In addition to the onboard integrated graphics, the chipset's SDVO bus can be used to connect to DVI, TMDS or additional LVDS device controllers by extension to a custom carrier board.

For I/O expansion, the Express-ATC and Express-ATR support three PCI Express™ x1 lanes via the Intel® I/O Controller Hub 7-M (ICH7-M) Southbridge, one Gigabit Ethernet connection and two SATA channels. Legacy support is provided for one Parallel ATA channel, 32-bit PCI™ and Low Pin Count bus (LPC).