Yamaha Robotics introduces solder-paste inspection system

The VP-01G-Y combines high-speed and high-resolution inspection in one device, employing sophisticated algorithms in both 2D and 3D modes for improved focusing and contour extraction. Its analysis capabilities encompass 3D solder-paste and adhesive inspection, detection of foreign matter, and assessment of board warpage. These features support various processes including screen-printing, dispensing, and component placement. The system is designed to adjust for board warping and efficiently inspect flexible PCBs. Its advanced characteristics include a ring light source that delivers 360° illumination, ensuring reliable inspection and precise three-dimensional measurements.

Featuring a one-head design, the VP-01G-Y facilitates continuous, uninterrupted inspection. It offers a choice of 25µm, 20µm, or 15µm lenses, along with software-controlled, multiple-resolution switching for various settings. The resolution can be adjusted for each visual field, optimising throughput for boards with high interconnect density and mixed-size components, including extremely small 0201 and 03015 SMD chips.

Designed for seamless integration with the 1 STOP SMART SOLUTION for surface-mount assembly and the YSUP intelligent factory software, the VP-01G-Y extensively shares data with both upstream and downstream equipment. It automatically adjusts to setup-change instructions based on PCB identity, provides feedback on inspection results to improve print quality, and forwards bad-mark data to reduce component-mounting cycle times.

The VP-01G-Y enhances data-driven capabilities in surface-mount assembly within a compact footprint of 938mm x 1,191mm. It can accommodate board sizes ranging from 50mm x 50mm to 510mm x 510mm, meeting production requirements in various sectors such as automotive, medical, industrial, and consumer electronics manufacturing.