RADSOK R4 delivers connections up to 200A

7th November 2013

Amphenol Ltd

Jacqueline Regnier

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Offering better mechanical strength than other contact systems on the market, the new RADSOK R4 is the latest version of Amphenol's RADSOK technology high current contact system. Available in board-to-board, wire-to-board and busbar-to-board configurations, RADSOK R4 is easily configured to specific application requirments and features a lower temperature rise than other traditional contact systems in its class.

Ideal for use by both server and board manufacturers, RADSOK R4 delivers connections up to 200A and, owing to its lower temperature rise, enables smaller overall connector packaging and compact footprints. The system’s hyperbolic grid contact provides multiple points of contact and a high contact surface area for efficient and low resistance power transmission. With a 25% reduction in outside diameter over previous models, the new R4 helps to further increase power density and save space.

Amphenol’s RADSOK R4 is easily configured to specific application requirements. The versatile RADSOK contact can be efficiently adapted to custom packaging with minimal non-recurring engineering costs. The proven RADSOK radial contact design offers superior mechanical and electrical performance for high current board termination. The system offers more consistent performance as well as lower voltage drop and contact resistance. For enhanced radial float tolerance in applications that require blind mate or mechanical robustness, RADSOK Super Twist R4 contacts are available.

RADSOK R4’s laser welded assembly offers better mechanical strength than other contact systems on the market.