Connector and cable assemblies free up PCB space
Connector and cable assemblies from TE Connectivity which offer a footprint that is up to 50 percent smaller than current SFP+ interconnects are in stock at Mouser Electronics. The assemblies help designers increase faceplate density while freeing additional PCB space. The products’ designs have been enhanced to improve signal routing, minimise electromagnetic interference (EMI), and optimise automated manufacturing processes.
The assemblies take up as little as 15 mm of board space, with one micro SFP+ connector freeing up to 19 percent more faceplate space than a single SPF+ connector. The cable assembly and connector provide a staggered contact configuration that helps improve signal routing, and the 22-position connector supports data rates up to 10Gbps.
The integrated connector and cage with solder tail is designed for one-step board placement, and the connector can withstand up to 265 degrees Celsius for high-temperature pin-in-paste soldering. The AWG 26 cable features a 360-degree braid crimp and an extended shield to minimise EMI.
TE’s micro SFP+ connector and cable assemblies are electrically compliant to SFF-8431 and support a number of protocols including 10 Gigabit Ethernet, Gigabit Ethernet, and Fibre Channel over Ethernet (FCoE). The micro SFP+ interconnects are designed for telecommunications, data communication, medical diagnostic equipment, and networking applications.
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