Mouser, Molex explore future of miniaturisation in technology

The Future of Miniaturisation in Technology features articles, videos, and an infographic exploring the forefront of miniaturisation trends shaping our connected future. The content covers miniaturisation in AR/VR, medical and consumer wearables, mmWave, IoT and automotive applications.

The content series also showcases many key products from Molex that play important roles in addressing the design challenges of miniaturisation.

Featured solutions include the Molex SMP-MAX and SMP-MAX EVO 50Ω RF connectors.

These microminiature connectors offer push-on and snap coupling options and configurations in both surface mount and through-hole mounting options. High-power ratings of up to over 300 W at 2.7 GHz provide excellent performance for RF amplifiers.

The Molex Quad-Row board-to-board connectors are designed to enable high power in a compact form factor. With these high-density connectors, designers can include more features, sensors, and functionality into increasingly tight spaces without compromising device performance.

These connectors are ideal for AR/VR devices and other wearables.

The Molex Contrinex inductive sensors are robust, self-contained, and include an integrated IO-link, making them ideal for limited-space applications. These sensors feature a large sensing range and a smart communication system that continuously monitors process data and diagnoses sensor status.

Their one-piece factor-1 steel and aluminium housing provides rugged mechanical and chemical protection from extreme conditions. The small form factor of the Contrinex inductive sensors make them suitable for integration into machinery, equipment, and even hazardous or hard-to-reach locations, providing a scalable and flexible solution for modernising industrial processes.