Interconnect solutions meet COM-HPC standard

Designed to meet the COM-HPC standard recently introduced by the PCI Industrial Computer Manufacturers Group (PICMG), Samtec’s COM-HPC products are high-density, high-performance connectivity systems for emerging technologies such as artificial intelligence (AI), machine vision, embedded edge computing, cybersecurity, 5G infrastructure and connected vehicles, industrial automation, and Internet of Things (IoT).

These interconnect solutions are based on Samtec’s AcceleRate HP high-performance arrays, providing design engineers the scalability and enhanced performance for next-gen embedded system design and interface flexibility.

Featuring paired 400-pin connectors (800 pins total), COM-HPC systems offer 32 Gbps per channel, 2088 Gbps per square inch, and 4096 Gbps max aggregate up to 300 W (from 11.4 V – 12.6 V), while supporting existing and future interfaces like PCIe 5.0 (32 GT/s) and 100 Gb Ethernet.

Ideal for server and client modules, medical, datacom, telecom, IoT, or other high-speed, high-cycle applications, the COM-HPC interconnect solutions are available in both 5 mm and 10 mm stack heights and 0.635 mm pitch.