Cables/Connecting
Fine Pitch Bump Adapters Now Allow for SMT Adaptation of TSSOP, QFP and Other Fine-Pitch Devices
Aries Electronics now offers a line of adapters which convert TSSOP, QFP and other fine pitch devices to any other fine-pitch bumped package or routing configuration down to 0.4mm pitch. These unique Fine Pitch Bump Adapters are mounted to the existing PCB via raised pads up to 0.010 (0.25mm) on the adapter bottom. The adapters feature pads on the component side designed to accept any device on any pitch (0.5mm or greater) and easily route the signals for packages including TSSOP, QFP and other fine-pitch devices down to 0.40mm.
The Aries’ Fine Pitch Bump Adapter boards are 0.032 (0.813mm) thick FR-4 or Rogers 370HR, with ½-oz. copper traces on both sides. The non-solder mask defined (NSMD) pads are finished with electroless nickel immersion gold (ENIG). The adapters can operate up to 221°F (105°C) for FR-4 and 266°F (130°C) for lead-free.
The new adapters are available on tape-and-reel for high-speed SMT assembly and can be manufactured for RoHS compliance. Standard line and trace spacing down to 0.003 (0.076mm) can be used.
Fine Pitch Bump Adapters are available in panelized form, as an adapter only, or as a turnkey solution with devices mounted. Aries specializes in custom design and production. In addition to standard products, special materials, platings, sizes and configurations can be furnished depending on quantity. For more information regarding an adapter to meet specific needs, contact us today.
Pricing for a 64-lead adapter starts at $25.67. Delivery is 15 working days.
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