ECOC 2009: Molex to showcase latest innovations in optical interconnects
Molex will be highlighting its new and innovative ranges of optical interconnects during this year’s ECOC exhibition in Vienna, Austria. Synonymous with optical fibre and telecommunications in Europe, the event unites academia and industry in discussion and displays the latest (and future) optical communications components, products, systems, and services. Hot topics of discussion will include new fibre-based components, modulation schemes for high speed transmission, 100 Gbps Ethernet and broadband access.
During the show Molex will present a number of innovative products, including its lensed MT ferrule-based and SMI plastic optical fibre interconnects and simplified SFP (small form-factor pluggable) receptacles. Visitors to the Molex stand (Booth 462) will have the opportunity to see these products first hand, as well as speak to key product engineers on their project needs.
An annual event, this year’s European Conference and Exhibition on Optical Communication (www.ecoc2009.at) will take place on 21st to 23rd September, 2009 at the Austria Centre Vienna in Vienna, Austria. The show will feature over 250 exhibitors and a comprehensive speaker line-up, including some of the world’s leading technical developers, both commercial and academic, addressing key industry topics.