Direct solder terminals suit space constrained applications

In addition to a very low profile, the SolderRight one-piece crimp solder terminal includes unique design features such as multiple terminal and wire sizes, solder pins positioned between insulation and conductor crimps and twin solder pins. Terminal wire sizes range from 14 to 28AWG enabling both signal and power current capability while optimising PCB space. Solder pins positioned between insulation and conductor crimps offer superior wire strain relief and resist terminal and solder join breakage. Molex twin solder pins provide stability for solder processing and allow redundant current paths.

Michael Bean, Global Product Manager, Molex, comments: "The most common problem found in products that require a direct solder wire termination is that wires become over stressed from being bent at a 90° angle after soldering, resulting in long term reliability concerns. By replacing the soldering process with a direct board-in crimp terminal, this problem is eliminated. There is an industry need for very low-profile packaging and wire termination that simplifies the connection process and increases reliability all while saving both cost and space. Molex SolderRight direct solder terminals deliver meaningful value to our customers on all fronts."