Connectors achieve 56 G PAM4 data rate requirements with higher density
Amphenol Aerospace has developed the MIL-HD2 in alignment with the open group Sensor Open Systems Architecture (SOSA) technical standard.
MIL-HD2 provides developers with a readily available robust open architecture solution for tighter card pitches and chassis designs where space requirements and density are critical. These connectors are available in 3-, 4-, and 6-pair configurations, providing the MIL-embedded market with the highest count of differential pairs available today in a 3U configuration at 56 Gb/s PAM 4 speeds.
This series was selected by the SOSA Consortium and provides a SOSA-aligned solution for NextGen switch and payload card requirements enabling the MIL-embedded market to meet next-gen performance levels while still meeting COTS requirements.
The connectors enable data rates scalable to 56 Gb/s PAM4 to support system upgrades without costly redesigns.
Features include
- Proprietary crosstalk-reducing technologies
- 15.7 mil drill compliant pin allows deeper back drilling
- Optimised footprints
- Shielded contacts mate before signal contacts, providing up to a 4 mm minimum wipe
- Highest density with 1.80 mm pitch
- Proven EMI and signal integrity advantages
- Improved impedance matching
- Enables hot plugging
Applications are:
- Commercial and military aerospace
- Missile defence
- Space data centres and other space systems
- Radar and sonar equipment
- Intelligence, surveillance, and reconnaissance systems
- Ground combat systems
- Sensors, switches, and integrated processors
- Electronic warfare (EW) and C5ISR systems
- Embedded computing
- Phased array radars
- Single processing computers
The connectors are in stock at distributor Digi-Key.