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Ultra-Low Silicone Thermal Gap Filler Provides High Thermal Conductivity and Conformability

22nd October 2009

ES Admin

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MH&W International has added new TP-S3LS ultra-low silicone gap fillers to its line of thermal interface materials. TP-S3LS pads contain less than 50 parts per million of silicone while providing 3.0 W/mK of themal conductivity between hot components and their heat sinks. The gap filler’s minimal silicone content makes it suitable for use in silicone-sensitive applications including medical electronics, laser optics and telecommunications where silicone-based outgassing can lead to contamination and condensation issues or leave oily residues that interfere with process applications. The TP-S3 family of materials was developed by Chang Sung Corp. and is manufactured by Dongyun Electronics in South Korea.

Pads of TP-S3LS material are soft and compliant for easy compression and filling of air gaps between between irregular mating surfaces. The material’s Shore 00 hardness is 55. TP-S3LS pads can be used in temperatures up to 200°C, which exceeds the use range of silicone-free gap fillers. The material has a UL 94 flame class rating of V-0. Its dielectric breakdown voltage is more than 5.0 kV.

New TP-S3LS gap filler material is available in 210 x 297 mm (8.3 in x 11.7 in) sheets or die-cut parts. Standard sheet thicknesses range from 0.5 to 5.0 mm (0.020 in to 0.196 in). An optional fiberglass liner is available on 0.5 mm (0.020 in) thick pads where added handling strength is needed.

Pricing for standard flat TP-S3LS sheets starts at $0.10 per square inch, which is below the cost of other 3.0 W/mK thermal gap fillers now available. Lower priced TP-S3 gap fillers are also available with thermal conductivities of 2.0 and 1.0 W/mK.