Enclosures
Laird Technologies Releases the Latest in a Series of Thermal Management Application Notes
Laird Technologies, Inc., a global leader in the design and manufacture of customized, performance-critical components for wireless systems and other advanced electronics applications, today announced the release of its newest application note titled “Thermoelectric Assemblies and Modules for Telecommunication Applications”. This application note is the newest in a series of notes describing the role of Thermal Management in numerous market segments.
The “Thermoelectric temperature stabilization is a major factor to consider in the design and operation of sensitive telecommunication devices. TEMs and TEAs offer many benefits including compact size, low weight and precise temperature control versus alternative cooling technologies,” stated Andrew Dereka, Laird Technologies Thermoelectrics Product Manager. “Their solid-state construction contributes to long term reliability while minimizing the total cost of ownership of maintaining cooling systems in the field.”
Today’s telecommunication operating environments provide for extreme operating conditions and rugged requirements. TEMs and TEAs are necessary to provide precise temperature control via cooling and heating in a variety of modular platforms. Their advanced capabilities are aided by new material technologies, thinner profiles, and automated assembly. Combining these special benefits make TEMs and TEAs the only effective solution for telecommunication thermal management applications by offering greater performance, higher reliability, and low cost of ownership.