Catalogue Features 380+ Heat Sinks Available in 24 Hours

The catalogue includes a wide range of ATS maxiFLOW heat sinks which feature a low profile, spread fin array to maximize surface area for more effective convection (air) cooling. Testing at an air flow rate of just 0.5 m/s (100 ft/m) shows that device junction temperatures (Tj) can be reduced by more than 20 percent below the temperatures achieved using other heat sinks of comparable size and volume.

Also included in the catalogue are heat sinks specifically designed for cooling a variety of Freescale processors and a wide range of BGAs, LGAs, ASICs and LED lighting strips. Straight-fin and cross-cut heat sinks can also be found in the catalogue.

Most of the heat sinks are provided with thermally conductive adhesive mounting tapes or mechanical attachment systems for installation on hot components. These include the ATS maxiGRIP system, which features a stainless steel spring clip and plastic frame clip to provide secure attachment to the component and eliminates need to drill holes in the PCB. The system also allows for the use of high-performance phase-change materials that improve heat transfer as well as simple heat sink detachment and reattachment without damaging the component.

To receive a copy of the new Heat Sink Catalogue by mail, please visit the ATS website www.qats.com and click on the “Ask the Experts” link or call 781-769-2800. An electronic version of the catalogue is also available for download on the site.