Bopla presents the new BoVersa electronics enclosure

This new and progressive enclosure concept provides flexible and customer-specific design opportunities in addition to a modern design which includes an illumination concept and forward-looking cooling. BoVersa offers optimal preconditions for use with the Internet of Things or embedded systems.

Andreas Krömer, Head of BOPLA’s development department, says: “With BoVersa, we are meeting users’ increasing needs and adding to our portfolio in a targeted way. We offer an integrated solution for a wide range of sectors which we have continued to develop on the basis of modern market requirements.”

Three-part assembly of base, lid, and front frame

During the development phase, the focus was on both flexibility and functionality. The three-part enclosure assembly consists of the base, lid, and front frame which can be combined as required. In addition to the classic plastic version, customers can choose an enclosure base made of die-cast aluminium with moulded-on cooling fins and fixing brackets. The open front frame is also optimal for the integration of keypads and displays, and the closed variant allows a clean look or individual designs. The enclosure parts are combinable using different colours – this means that the design and function can be varied flexibly in respect of design, material, and colour.

The transparent lid provides a view of the enclosure interior or of fitted displays. With it or the translucent lid, photometric design accents, impressive lighting effects, and status signalising are also possible. In addition, colour accents can also be achieved by combining enclosure parts in different colours – including customer-specific ones on request. Individual processing of the closed front frame allows almost unlimited possibilities for changing its appearance.

Krömer says: “The absolute freedom for designing the front frame, without influencing the type of protection, is something unique for the user.” Customers who also benefit from this are those who want to give their product as individual an appearance as possible but at the same time do not want to have the development time and make the investment in tools for a completely individual enclosure.

Flexible in use for a range of applications

Another new feature is the future-oriented cooling technology which BoVersa offers. The symmetrical design of the corresponding fins makes possible an optimal flow of air in both the horizontal and vertical mounting positions.

The enclosures can be used for handheld applications or on a desktop, wall, or mast. That is why the enclosure offers optimal preconditions for, among others, the Internet of Things or embedded systems. In addition, the metal base and the plastic lid provides the best-possible combination for wireless applications which require cooling.

Krömer states: “Our customers can start their relevant projects in good time. The most important system components will be available ex-works just a few weeks after the trade fair.”

In addition to BoVersa, in Nuremberg BOPLA will be demonstrating its wide-ranging portfolio in the enclosure technology sector, together with HMI and services. The focus is on customer-specific solutions.

He continues: “We act in forward-looking and user-friendly ways to ensure that customers can continue to design and optimise their processes and operations efficiently.”