Evaluation kit targets ultra low power designs

The user interface enables two modes: the first mode is a live temperature mode, where data is measured using the on-chip temperature sensor of the MCU and streamed back to the user interface through the backchannel UART.

The second mode demonstrates the data logging capabilities of the MCUs’ 64KB of embedded, non-volatile FRAM, by disconnecting it from the computer and using the on-board super capacitor for power. The included 16-bit MSP430FR5969 MCU supports CPU speeds up to 16MHz, and has integrated peripherals for communication, ADC, timers, AES encryption and more.      

Additional features of the MSP-EXP430FR5969 LaunchPad Kit include an onboard eZ‑FET emulation with EnergyTrace++ Technology that enables developers to analyse power consumption down to 5nA resolution in real time for each peripheral.

To allow for rapid prototyping, the kit also features a 20-pin LaunchPad standard that leverages the BoosterPack ecosystem. TI’s BoosterPack enables technologies such as wireless connectivity, graphical displays, and environmental sensing.      

The kit includes the MSP-EXP430FR5969 evaluation board, a micro USB cable and a quick start guide. It gives designers an entry into a variety of ultra-low-power applications, ranging from metering, wearable electronics, consumer electronics, the Internet of Things (IoT), industrial and remote sensors, home automation and energy harvesting.      

Free software development tools are also available for the MSP-EXP430FR5969, such as the Eclipse-based Code Composer Studio and IAR Embedded Workbench, through the Texas Instruments website.