Kontron new COM-HPC server module with Intel processor

The module offers scalability from 2 to 10 cores, SKUs for the extended industrial temperature range and 24/7 reliability over 10 years. These features enable very robust implementations for harsh environments and extreme conditions in a small form factor.

With dimensions of 120 x 160 mm in "Size D small", the COM-HPC server module is even smaller than the usual COM-HPC Size D design (160 x 160 mm). As all components are soldered, the module is particularly resistant to shock and vibration. The module is also available in an extended temperature range of -40°C to +85°C, making it ideal for outdoor applications. It has a maximum of 64 GB soldered DDR4 memory at 2933 MT/s. A soldered NVMe SSD onboard with up to 1TB storage capacity is available as an optional storage medium.

With 32x PCIe lanes (16x PCIe Gen3 plus 16x PCIe Gen4 lanes) and 2x Quad LAN interfaces that support up to 100 Gbit Ethernet, the COMh-sdIL offers high data throughput rates for demanding I/O and network structures. With its scalable performance, complemented by AI acceleration with Intel AVX-512, the module is ideally suited for complex AI applications, high-performance network platforms and Edge applications in outdoor environments.

"The module offers balanced functionality in terms of the number of cores, its memory capacity and LAN interfaces. Based on this platform, solutions for the extended temperature range can be implemented. In addition, long-term availability, an important aspect in the embedded market environment, is guaranteed," explains Irene Hahner, Product Manager for COM-HPC modules at Kontron.

Parallel to the COMh-sdIL, a COMh/Server Application Carrier in an optimized small format and a Board Management Controller (BMC) as a plug-on module for the carrier are being developed. With these building blocks in small form factor design, Kontron offers a complete system solution for space-critical applications and harsh environmental conditions.