IoT sensor development kit cuts system size, cost
The SmartBond DA14583 Internet of Things (IoT) sensor development kit from Dialog Semiconductor is now being shipped by distributor Mouser Electronics. Merging Bluetooth Smart hardware, sensors, and sensor fusion software, it enables the world’s lowest power 12 degree-of-freedom (DOF) wireless sensor module.
Highly integrated into a plastic dongle, the kit cuts system size and cost and includes all essential hardware and software to speed creation of advanced IoT devices.
The IoT sensor development kit is a complete development platform that helps designers create sensor-based IoT applications.
The dongle integrates a Dialog DA14583 Bluetooth Smart system-on-chip (SoC) with an embedded ARM Cortex-M0 processor, and three Bosch Sensortec MEMS sensors: a BMI160 6-axis inertial measurement unit, a BMM150 3-axis geomagnetic field sensor, and a BME280 integrated environmental unit.
The dongle also incorporates a software development kit (SDK) that includes Dialog’s sensor fusion software library, SmartFusion, for data acquisition, sensor calibration, and sensor data fusion.
The low-power dongle consumes just 1.3mA when streaming sensor data, less than 110µA in advertising mode, and under 11µA in power-save mode.
The development kit also includes an app for iOS and Android for data visualization on tablets or smartphones.
The Dialog SmartBond DA14583 IoT sensor development kit is ideal for 12-DOF and 9-DOF sensor-based applications, including environmental and motion-sensing modules for wearables, immersive gaming, augmented reality, 3D indoor mapping and navigation, and weather stations.
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