Development kit supports AI applications

The ConnectCore MP255 kit boasts a versatile, secure, and cost-effective wireless system-on-module (SOM) designed for maximum power efficiency to support battery-powered and industrial AI applications. 

This development kit features a robust STMicroelectronics STM32MP255C 64-bit microprocessor tailored for industrial settings, with a neural processing unit (NPU) and image signal processor (ISP) for edge AI and computer vision applications and time-sensitive networking (TSN).

It comes in a compact SMTplus form factor (30 x 30 mm), making it ideal for small portable devices and Industry 4.0 applications.

The development kit also delivers access to the STM32MP255C's high-end graphics capabilities, such as an integrated 3D GPU, video encoder and decoder (VPU), high-resolution MIPI, LVDS or parallel display interfaces, as well as a MIPI camera port with an ISP and the flexibility to run AI applications on the CPU, GPU, or NPU. 

The ConnectCore MP255 kit also supports high-end edge computing applications like machine vision, leveraging multimedia capabilities made possible by the comprehensive ST Edge AI ecosystem.

It provides fully integrated wireless connectivity with pre-certified Wi-Fi 6 (tri-band 6E ready), 802.11ax and Bluetooth 5.4, along with PCIe Gen2, USB 3.0, CAN-FD and Gigabit Ethernet with TSN support.