Awards

The Electronics Excellence Award: shortlist announcement

19th March 2024
James Anstee
0

Welcome to the shortlist announcement page!

Here you will find the amazing shortlisted products for the most rigorous and transparent award in the industry.

The Electronics Excellence Award ceremony will be taking place at the Electronic Specifier booth (Hall 5-144) on the first day of embedded world on 9th April at 2:00pm. You are all welcome to come and visit to see which product will win!

Comment below which product you think will win the Electronics Excellence Award.

 

N-and Group – 4CR 

 

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The 4CR is a high-tech system that keeps in field connected devices running smoothly. This innovation takes a smart and simple approach to make sure machines work well without any complicated corporate jargon. At the core of the 4CR system is an ability to learn and adapt. By carefully collecting data from different machines, the system uses self-learning technology to detect patterns. This means it can recognise and predict potential issues as they start to happen, ensuring quick and effective maintenance.   

Find out more about the product here: N-and Group | Innovative Technology |

 

NeumondaRhinoe Tester 

 

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Qualification and testing of semiconductor components is one of the most expensive and complicated parts in the manufacturing of memory ICs. Due to the size, complexity, and costs of the equipment, only few companies can afford to implement test capabilities. And those who do, need to test high volumes to recoup the investment. To solve these pain points, Neumonda Technology developed its Rhinoe tester. The new tester enables Neumonda to conduct vendor-independent tests that also simulate the actual environment in which the DRAM memory is going to be used in to predict potential failures much more accurately. All this at a fraction of the investment costs of traditional testers.  

Find out more about the product here: https://www.neumonda.com/neumonda-technology/

 

Ambarella – N1 SoC series 

 

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Ambarella is bringing generative AI capabilities to Edge-endpoint devices with its new N1 system-on chip (SoC) series architecture, which is optimised for running multi-modal large language models (LLMs) with one to 34 billion parameters in alow power footprint. Multi-modal LLMs run on the new N1 SoC series at a fraction of the power-per-inference of leading GPU solutions.As with all of Ambarella’s AI SoCs, the N1 series is supported by the company’s new Cooper Developer Platform. Additionally, in order to reduce customers’ time-to-market, Ambarella has pre-ported and optimised popular LLMs, such as Llama-2, as well as the Large Language and Video Assistant (LLaVA) model running on N1 for multi-modal vision analysis of up to 32 camera sources. 

Find out more about the product here: https://www.ambarella.com/news/ambarella-brings-generative-ai-capabilities-to-edge-devices-introduces-n1-system-on-chip-series-for-on-premise-applications/ 

 

CervozM.2 2230 (A+E key) NVMe SSD 

 

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The Cervoz M.2 2230 (A+E key) NVMe SSD, a prominent member of the T425 series, represents a significant advancement in industrial computing. This product is crafted to optimise space in compact embedded systems and fanless industrial PCs. Its A+E key interface enables more efficient use of motherboard sockets compared to traditional M or B key designs. The T425 series demonstrates a blend of compactness, high performance, and capacity. It supports the PCIe Gen3x2 interface and adheres to NVMe 1.3/PCI Express Base 3.1 standards, offering sequential read and write speeds of up to 815MB/s and 760MB/s, respectively. Capacity-wise, the T425 offers up to 512GB, which is significantly greater than what other A+E key-utilised storage options provided. 

Find out more about the product here: https://bit.ly/48UDKim 

 

Codasip – CHERI Technology 

 

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Codasip is making Capability Hardware Enhanced RISC Instructions (CHERI) available in its RISC-V processor cores. CHERI extends conventional hardware Instruction-Set Architectures (ISAs) with new architectural features to enable fine-grained memory protection and highly scalable software compartmentalisation. The technology has been developed by the University of Cambridge during the last decade and is now for the first time available in a commercially licensable product. The company has implemented the CHERI technology thanks to Codasip Studio. This is its collection of tools for fast and easy designing or modification of processors. Using Codasip Studio, it has added built-in, fine-grained memory protection by extending the RISC-V ISA with CHERI-based custom instructions. 

Find out more about the product here: https://codasip.com/solutions/riscv-processor-safety-security/cheri/ 

 

KYOCERA – 9002305L0: UWB LDS antenna ‘Tulip’ 

 

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KYOCERA AVX’s 9002305L0, also known as the Tulip, is an on-board and on-ground (works over metal) antenna optimised for UWB applications spanning 6.0 – 8.5GHz. This antenna is manufactured using Laser Direct Structuring (LDS) technology to allow a 3D pattern design. Its small form factor 6.40 x 6.40 x 5.52mm size supports SMT assembly. The antenna design is engineered to provide an omni-directional radiation pattern and, more importantly, a constant phase around the antenna for improving UWB systems’ accuracy. 

 Find out more about the product here: https://www.kyocera-avx.com/product/9002305l0-uwb-lds-antenna-tulip/ 

 

 

Menta SAS – MOSAICS-LP 

 

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MOSAICS-LP is an industrial platform specifically designed for the development of heterogeneous chips, exploiting a universal chassis, and based on a catalogue of third-party chiplets. This significantly reduces chip design time (from two years to six months), and cuts design costs (by a factor of 10). MOSAICS-LP responds to the major challenges of Edge computing and AI, in particular for the defence, industrial, and mobility markets by providing an effective solution to the problem of shortages of electronic components. 

Find out more about the product here: https://f4a843df-5051-4443-bae4-fe59dcd1d2f6.usrfiles.com/ugd/f4a843_90482f2c16e34f8fa08e4267527704e3.pdf 

 

Rohde & Schwarz – MXO 5 oscilloscope  

 

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Having engineered its MXO-EP custom ASIC for oscilloscopes to support extremely high instrument performance with superior features at an ultra-competitive price point, Rohde & Schwarz has now integrated two of these chips to create the R&S MXO 5.Together, they create an engine that makes the R&S MXO 5 the world’s first eight-channel oscilloscope with 4.5 million acquisitions per second, capable of resolving 18 million waveforms per second across multiple channels. With this performance, the R&S MXO 5 can show more of a signal’s activity in both the time and the frequency domains than any other oscilloscope. Users can capture intricate signal details and infrequent events with high precision. With minimal blind time of 20ns, it can capture up to 99% of real time waveforms, which is ideal for elusive waveform events. 

Find out more about the product here: https://www.rohde-schwarz.com/product/mxo5 

 

Red Pitaya – Click Shield 

 

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In collaboration with MikroElektronika, Red Pitaya launched the Red Pitaya Click Shield, which provides an enhanced Red Pitaya experience.A credit-card sized RF signal acquisition and generation platform, the Click Shield pioneers the shift from closed, fixed-functionality instruments to multifunction, open-source software-defined instruments capable of catering to a broad spectrum of customers across various market segments. The Red Pitaya Click Shield offers a streamlined solution to challenges in embedded systems development. Equipped with two mikroBUS sockets, the Red Pitaya Click Shield enables the integration of diverse functionalities from MIKROE's expanding collection of Click boards, ranging from sensors and Wi-Fi transceivers to motor control and audio amplifiers. 

Find out more about the product here: https://go.redpitaya.com/red-pitaya-click-shield 

 

STMicroelectronics ST87M01 ultra-compact and low power module 

 

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STMicroelectronics’ ST87M01 ultra-compact and low-power modules combine reliable and robust NB-IoT data communication with accurate and resilient GNSS geo-location capability for IoT devices and assets. The fully programmable, certified LTE Cat NB2 NB-IoT industrial modules cover worldwide cellular frequency bands and integrate advanced security features. As one of the first IoT cellular products worldwide offered in accordance with the latest 3GPP Release 15, the ST87M01 provides extended multi-regional LTE coverage.Qualified over the industrial temperature range (-40 to +85), with ultra-low power consumption less than 2µA in low-power mode and transmit output power up to +23dBm, the ST87M01 targets wide-ranging IoT applications that require ultra-reliable Low Power Wide Area Network (LPWAN) connectivity. 

Find out more about the product here: www.st.com/ST87M01 

 

Winbond Corporation TrustME Secure Flash W77Q 

 

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The TrustME Secure Flash addresses several critical challenges in IoT and automotive security, offering a comprehensive solution with advanced features.It guarantees the integrity of firmware within flash memory, protecting IoT devices from unauthorised alterations in vulnerable settings.By adopting TCG DICE, it secures device identity and fortifies defences against unauthorised software changes. It employs quantum-resistant cryptographic algorithms (LMS/XMSS) to maintain security against the advancements in quantum computing. It adheres to CNSA 2.0 standards, equipping devices for upcoming security requirements in the ever-changing threat landscape. 

Find out more about the product here: https://www.winbond.com/hq/product/trustme/w77q-trustme-secure-flash-memory/?__locale=en 

 

Littelfuse – TTape Distributed Temperature Monitoring Platform 

 

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Littelfuse, Inc. introduces an advanced overtemperature detection solution called TTape Distributed Temperature Monitoring Platform, which is set to revolutionise the electric vehicle (EV) and Battery Energy Storage Systems (BESS) industries. This product offers a unique capability to detect overtemperature at every Li-ion cell, providing superior safety and enhancing battery life. The essence of the TTape platform lies in its distributed temperature sensing, offering precise detection of overheating in individual cells. This approach not only improves battery life but also enhances the safety of battery installations.By proactively managing cell aging, TTape effectively minimises the risk of thermal runaway, a critical concern in battery technology. 

Find out more about the product here: https://www.littelfuse.com/products/temperature-sensors/digital-temperature-indicators/ttp 

 

Silicon Motion FerriSSD PCIe Gen4 

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The FerriSSD is a PCIe Gen4 Single-Chip SSD developed by Silicon Motion, designed to meet the storage demands of diverse embedded applications, particularly in rugged environments. The FerriSSD integrates an on-chip heat sink combo with an active monitoring algorithm. This ensures effective thermal heat dissipation, addressing the challenges of heat-related issues in industrial and rugged environments.It implements EMI/EMS-induced SER protection features, safeguarding the SSD against electromagnetic and environmental interference.The SSD features an intelligent proactive data integrity scan and repair mechanism. This not only enhances the overall performance and reliability of the SSD but actively extends the service life and data integrity of NAND, a critical component in data storage solutions. The USP lies in its autonomous protection capabilitiesleveraging Silicon Motion's proprietary technologies allows for hands-free intervention from the user or host. This autonomy becomes crucial in scenarios involving heat-related data corruption, environmental challenges, and extended SSD usage. 

Find out more about the product here: https://www.siliconmotion.com/download/DWbY/a/PCIe_Gen4_NVMe_FerriSSD_PB_EN.pdf 

 

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