Analog Devices – The ADTF3175

The module delivers a turnkey, scalable system that provides high-accuracy and robustness over variable environmental conditions. Moreover, the module abstracts the burden of optical and electromechanical system design and delivers a fully engineered and calibrated depth system to designers allowing them to concentrate on bringing new 3D sensing and vision systems to the market. It builds on the collaboration between Analog Devices and Microsoft to deliver the highest resolution 3D depth sensing module to the broad market.

Time-of-Flight technology is complex to implement for typical customers. It requires capabilities in optical, mechanical, and high-speed electrical design, combined with sophisticated system engineering expertise and supply-chain breadth around chip-on-board, optics, etc. The result of this complexity has limited the access to this ground-breaking technology. Current high quality depth cameras that are custom engineered tend to be expensive. The goal of the ADTF3175 is to democratise the access to high-performance (ToF) to the broadest base of users while bringing to bear Analog Devices expertise and understanding of the industrial market with respect to technical challenges, quality, and product lifetime.

Visit Analog Devices at electronica, C4.125 and chat to the team about the ADTF3175 Time-of-Flight module for 3D depth sensing and vision systems.

Find more information about the product here: Analog Devices Launches Industry’s First High-Resolution Module for 3D Depth Sensing and Vision Systems | Analog Devices