Artificial Intelligence

Image recognition processor delivers ADAS functionality

24th February 2016
Jordan Mulcare
0

Toshiba Electronics Europe has expanded its line-up of image recognition processors with a fourth generation device that will help designers implement ‘entry-level’ ADAS (Advanced Driver Assistance System) applications targeting Euro NCAP 2018 camera requirements.

Featuring 13 hardware-based image recognition accelerators, the TMPV7602XBG incorporates ADAS features that will become part of the Euro NCAP testing programme in 2018. These include AEB (Autonomous Emergency Braking), TSR (Traffic Signal Recognition), LDW (Lane Departure Warning) / LKA (Lane Keeping Assist), HBA (High Beam Assistance) and FCW (Forward Collision Warning). Toshiba’s device also supports a number of new applications such as TLR (Traffic Light Recognition) and night-time pedestrian detection.

ADAS applications are processed concurrently within a typical time window of 50ms inside the image recognition processor and with relatively low power consumption due to the purpose-built hardware accelerators and media processing engines (MPEs). The TMPV7602XBG can process up to five applications concurrently while consuming less power than other devices targeting mid- to high-end ADAS designs. By using a single video input channel a cost optimised camera system with a small form factor can be realised.

The TMPV7602XBG integrates enhanced CoHOG accelerators that provide far higher image recognition accuracy than previous devices - especially in low light and night-time conditions. Colour-based gradient analysis of images supplied by a full HD (2Mp) connected camera also improves night-time pedestrian detection rates.

Toshiba’s new processor can handle multiple applications simultaneously in real time using its Heterogeneous Multi-Core architecture. The device features newly-integrated image processing accelerators and four MPEs (Media Processing Engines) supported by FPUs (Floating Point Units) that perform double precision floating point arithmetic calculations.

The chip is housed in a BGA 521 ball package measuring 17x17mm with a ball pitch of 0.65mm. Sample shipments of the TMPV7602XBG will start in March 2016.

Featured products

Upcoming Events

View all events
Newsletter
Latest global electronics news
© Copyright 2024 Electronic Specifier