A new era of cost reduction in the semiconductor industry
Driven by the adoption of evermore electronic components in end products, the semiconductor industry is facing a new era in which device scaling and cost reduction will no longer continue on the path followed for the past few decades. Semiconductor companies are now looking for technology solutions to bridge the gap and improve cost-performance while at the same time adding more functionality through integration.
More-than-Moore devices (including MEMS & sensors, CMOS Image Sensors, power electronic, along with RF devices) represent this new functional diversification of technologies, combining performance, integration and cost not limited to CMOS scaling, and their importance will become more and more preponderant.
Between 2017 and 2023, the wafer demand for More than Moore devices is showing a ten percent growth. This increase is supported by the famous megatrends detailed in the new analysis, Wafer Starts for More Than Moore Applications, from by Yole Développement (Yole). This analysis is relevant to the following markets: 5G with wireless infrastructure and mobile segments, mobile including additional functionalities, voice processing, smart automotive & electrification, AR/VR, and AI.
Yole has invited you to an overview of the Wafer Starts for More Than Moore Applications report during the exclusive online event, titled Wafer Starts for More than Moore Applications – Webcast. This webcast took place on 28th June at 5:00 PM CEST. Speakers included: Corning Precision Glass Solutions, SPTS (an Orbotech Company) and Yole Développement.
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Analog Devices Inc.
3V to 80V, 3A, High-Efficiency, Synchronous Step-Down DC-DC Converter
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MAX22516
Analog Devices Inc.
IO-Link Data Link Controller with Transceiver and Integrated DC-DC
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