275 different ‘Middle-End’ factories for packaging at the wafer-scale Profiled

This wafer packaging fabs database features 275 factories with capacities for each advanced packaging platform



This second edition of the Wafer Packaging Fab database provides an exhaustive list of players involved in the Middle-End area. This unique tool provides a global overview of “who is doing what” in this emerging ecosystem. Many details concerning each fab location are provided (fab functions, customers, JV, capacities by wafer size etc.). In addition, Yole Développement proposes in this new version the analysis of installed capacities in the Middle-End area through 100+ charts, following 3 main angles:

- Advanced packaging platforms

- Players

- Geographical locations



All the charts are provided in the database Excel file and in a more than 100 slide PowerPoint document.



For the first time, new analysis and charts about capacities expansions have been integrated in the database, thus giving an overview of investments on the 2010-2014 time frame.



More than 150 entries by company!



Yole Développement’s database references 275 fab locations with technical information related to Wafer Level Packaging technologies or “Middle-End” capabilities.



The tool provides an exhaustive list of players (IDM, OSAT, packaging house, bumping house, etc.):

- Search by technology capacities and capabilities

- Study the profile and repartition of one given technology among the different industry players

- Study players manufacturing strategy, supply chain and worldwide strategy

- Find small and big volume sources for your products.



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