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Vishay Showcase Electro-Films Submounts, RF Capacitors And Wire-Bondable Products At OFC/NFOEC 2013

12th March 2013

Vishay

ES Admin

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Vishay will be showcasing its latest industry-leading Vishay Electro-Films solutions at the 2013 Optical Fiber Communications Conference and Exhibition/National Fiber Optic Engineers Conference, taking place from Mar. 17-21 at the Anaheim Convention Center in Anaheim, California. In booth 3343, products on display will include a wide range of Vishay EFI custom submounts, high-performance RF capacitors, and wire-bondable products.

Featured submounts at the 2013 OFC/NFOEC will include Vishay EFI’s AlN (aluminum nitride), BeO (beryllium oxide), and Al203 (aluminum oxide) ceramic substrates, which offer copper-filled vias, thick copper traces, and laser-machined shapes. For bonding, gold/tin solder features 70/30 to 80/20 compositions and thickness from 2 µm to 8 µm.

Also on display will be Vishay EFI’s RFCS surface-mount thin film RF capacitors for impedance matching circuits, decoupling, DC blocking, and lumped element filters. The devices feature capacitance from 0.2 pF to 27 pF, low DCR, and high Q and SRF. Highlighted wire-bondable products will include resistors with TCR to ± 25 ppm/°C and power ratings to 1 W; resistor networks with tolerances to 0.05 %; single and binary capacitors; and inductors with inductance from 3 nH to 150 nH.

The OFC/NFOEC is the largest global conference and exposition for optical communications and networking professionals.