Vishay Intertechnology to Showcase Industry-Leading Wire-Bondable and Ceramic Vishay Electro-Films Products at IMS 2011

At booth 4509, Vishay will be highlighting its wire-bondable thin film resistors, capacitors, and inductors for RF module, hybrid, and chip-on-board applications. In addition, the company’s ceramic thin film interconnect substrates will be on display for amplifiers, power dividers, filters, and other RF components.

Part of International Microwave Week, IMS is the world’s premier microwave conference. It features a large trade show, technical sessions, workshops, and panel sessions covering a wide range of topics, including wireless communication, radar, RF technologies, microwave electronics and applications, and more.