Texas Instruments, Azcom Technology and Nash Technologies present the industry’s first live 32-user femtocell demonstration at Femtocells World Summit

Earlier this year, TI, Azcom and Nash announced the availability of a 3GPP voice and data physical layer reference stack for UMTS femtocell products designed for Release 6 and 7 compliance and based on TI’s System-on-a-Chip (SoC) solutions. The scalability of TI’s SoCs and PHY libraries, and Azcom’s and Nash’s femtocell physical layer software, along with services from system integration to field support, will allow equipment manufacturers to quickly develop new picocell and femtocell products.

“The value of this partnership is that it truly offers customers a one stop femtocell solution which can support vendors and operators on all aspects of their femtocell system,” said Davide Barra, sales and marketing director, Azcom Technology and Karsten de Freese, femtocell program manager, Nash Technologies. “Based on our companies’ decade long experiences in W-CDMA system design, development, testing and integration, we can provide femtocell hardware, software and services of outstanding quality and performance.”

As the femtocell market requires the fastest possible time to market, both Azcom and Nash are providing a complete solution based on TI’s SoCs today. This system solution incorporates an integrated hardware reference design, including baseband and RF modules, together with a full Femto Forum compliant PHY layer. To complete the femtocell offering and ease customers’ development process, Nash and Azcom provide a complementary set of services to further accelerate the solution readiness. These capabilities include L2/L3 integration and certification, validation of the femtocell system by exploiting a complete test suite, covering all testing levels, from unit level up to end-to-end network level and user equipment IOT. System engineering support of the femtocell network, including all of the necessary assistance in field trial and deployment, are offered as well.