Analysis
STMicroelectronics and Tsinghua University Announce Long-Term Strategic R&D Partnership
STMicroelectronics and Tsinghua University, Shenzhen Graduate School, have reached a long-term strategic research partnership agreement. This agreement is the second phase of a collaboration that began in 2002 with the setup of a joint ASIC (Application Specific Integrated Circuit) research center.
STMiThe Graduate School and the Electronic Engineering department of Tsinghua University will staff the long-term partnership with talent, including graduates and technical staff that have important know-how for the market in China, such as local standards and technical specifications in various application fields.
“This partnership provides a great opportunity for Tsinghua University to develop IP blocks and ICs that meet market demand, raising our design and innovation skills to a new level,” said Prof. Kang Feiyu, Vice-president of Tsinghua University Graduate School, Shenzhen, “Leveraging our expertise, talents and management to extend the cooperation between us, the partnership is intended for applications that will be commercialized within five years, which is ideal for Chinese designers to sharpen their skills very quickly.”
Francois Guibert, Executive Vice President and President, Greater China and South Asia region, STMicroelectronics welcomed this deepening collaboration. “ST has had a strong technical presence in China for many years. This presence has included manufacturing, IC design and applications teams. The collaboration with Tsinghua will enhance ST’s capabilities to tailor our IC solutions to the local market needs.” Mr Guibert added, “This partnership with Tsinghua University will contribute to maintaining and further strengthening our relationship with industry leaders in the most dynamic and fastest growing market in the world.”
The collaboration with Tsinghua is part of an R&D network established by STMicroelectronics with many world leading universities, research institutes, customers and suppliers in Europe, Asia and America. It aims to bring a dramatic increase in the availability of advanced IP blocks and chips designed in China.