STMicroelectronics Announces World’s First 55 Nanometer Embedded Flash Process Technology for Automotive Microcontrollers

The 55nm eFlash technology builds upon ST’s 20-year expertise in embedded Flash and is also the continuation of the company’s successful 90nm eFlash automotive microcontroller family. Automotive market demands are driving the technology beyond the performance currently delivered by 90nm-based chips. Next-generation automotive systems will increasingly require MCUs with more computational performance, better power efficiency and greater memory content to meet market requirements in automotive applications, such as functional safety, tougher emission standards or ADAS (Advanced Driver-Assistance Systems) solutions. The new technology will enable ST to provide substantial performance improvement and greater value to its customers and will be the basis for ST’s future Automotive 32-bit Power Architecture™-based MCU roadmap.

ST’s eFlash technology has been developed, and also will be manufactured, at the company’s Crolles facility, which is automotive certified and is the world’s leading manufacturing site for 55nm eFlash. Same-site development and manufacturing means ST can deliver high process stability and exceptionally high levels of quality, in addition to long-term availability. At Crolles, ST is in production with 55nm technology for automotive products and has already produced several fully working embedded Flash technology test vehicles implementing key automotive system IP.

“Embedded Flash is an absolutely critical technology in a chip maker’s arsenal to deliver cutting-edge System-on-Chip ICs for automotive applications,” said Marco Monti, General Manager of ST’s Automotive Electronics Division. “Both the development and manufacturing at our Crolles site will ensure the high quality and adequate supply for our automotive customers.”

ST’s first MCU products to implement the 55nm eFlash technology are expected to target automotive applications, including engine management and transmission, car body controllers and safety/ADAS. First 55nm embedded-Flash product is expected to be available for customer sampling in mid-2011, and automotive qualification in 2013.