Analysis
STMicroelectronics Innovation Delivers Virtually Invisible Protection for Highest Performing High-Definition Connections
STMicroelectronics has simplified design and reduced the real-estate needed to protect the electronics behind the latest high-speed multimedia connections, with an all-in-one device compatible with today’s highest signal speeds and featuring the smallest package dimensions currently on the market.
With“The extremely high per-channel data rates of advanced multimedia connections increase the demands on devices protecting internal circuitry as the equipment is connected and disconnected,” said Eric Paris, Product Marketing Director, Application-Specific Discretes (ASD) and Integrated Passive and Active Devices (IPAD) Division, STMicroelectronics. “ST is responding to this challenge by expanding its HSP high-speed protection IC family to save part count and PCB space, and enable high-definition equipment to maintain ultra-high data rates.”
ST’s HSP061-8M16 ESD provides eight channels of protection, allowing designers to use only one device per connector, simplifying PCB design. In addition, the device has smaller dimensions than alternative approaches, which frees real-estate on the board for other value-added functions.
With ultra-low capacitance per line and extremely close matching between capacitance values, the HSP061-8M16 also minimizes slowing of data edges and prevents signal skew between adjacent lines. This prevents communication errors that ultimately can produce glitches in played-back HD images or audio.
Major features of the HSP061-8M16:
* 15kV ESD protection meeting IEC 61000-4-2
* 3.3 x 1.5 x 0.6 mm package
* 100 Ohm differential impedance
* 0.6 pF input/output capacitance
* 6.3 GHz bandwidth: compatible with HDMI, DVI, LVDS, Diiva, DisplayPort, USB3.0, SATA
The HSP061-8M16 is sampling now to lead customers, and will be available in a 16-pad uDFN package priced at $0.40 in quantities of 3000. Alternative pricing options are available for larger quantities.