STI Electronics to Feature Key Engineering Services at Space and Missile Defense Conference and Exhibition

STI’s Engineering Services division will feature its custom manufacturing for the defense sector, as well as counterfeit detection. Additionally, the microelectronics lab specializes in state-of-the-art engineering design and assembly including current technologies such as chip-on-board (COB) and multichip module (MCM) as well as emerging technologies such as STI’s patented packaging technology coined Imbedded Component/Die Technology (IC/DT®).