Report highlights conditions required for embedded die in substrate to achieve commercial success

But these advantages still have to be realistic at high volume manufacturing scales before being able to convince customers. Embedding die in laminate substrates is a promising packaging principle, but it has to overcome several challenges. One of these challenges is the supply chain. The process is being pushed by printed circuit board manufacturers such as AT&S and can create a new supply chain, bringing players into the semiconductor industry.

This supply chain comes along with business models, including packagers, module sellers, IDMs pushing for embedding solutions and R&D laboratories. One of the supply chain’s main advantages is the use of a mature, affordable manufacturing chain created initially for PCB manufacturing. That achieves low cost technology that would allow easier component integration, with easy access to both sides of the chips.

However, a new supply chain brings with it a lack of technical experience with embedding processes, and questions about business models that require clarification. In Fan-out and Embedded Dies: Technologies & Market Trends, Jérôme Azemar and the advanced packaging team analyse the applications that will drive the embedded die market in the future.

Single die are the first products currently being sold, demonstrating the technology’s capabilities. They are essentially low I/O applications with easy to embed dies, such as DC/DC converters for wireless products. Yole’s expectations are that the technology will show its real potential with more complex systems such as power application SiPs, whereby actives and passives will fully benefit from embedded packages thanks to good heat management and low inductance.

Among the technical requirements, Yole says that pad pitch on the die is especially important. In order to reach volume in the mobile/wireless market, sub-150μm pad pitches must be achieved. Some players, like TDK-EPCOS, claim they already have products with 50μm pitch. If technical and logistic objectives like this are achieved, and if an application provides a real boost in terms of initial large volumes, the overall market will be able to grow rapidly in the near future.

“The embedding allows a smaller form-factor, and it can be done using a mature manufacturing chain, providing low costs,” commented Jérôme Azemar, Technology & Market Analyst, Advanced Packaging and Manufacturing, Yole Développement. “The approach also offers good thermal performance, high integration capability and low inductance thanks to shorter connections.”